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Soldering in Electronics Assembly

Soldering in Electronics Assembly

          
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About the Book

Soldering in Electronics Assembly discusses several concerns in soldering of electronic assemblies. The book is comprised of nine chapters that tackle different areas in electronic assembly soldering. Chapter 1 discusses the soldering process itself, while Chapter 2 covers the electronic assemblies. Chapter 3 talks about solders and Chapter 4 deals with flux. The text also tackles the CS and SC soldering process. The cleaning of soldered assemblies, solder quality, and standards and specifications are also discussed. The book will be of great use to professionals who deal with electronic assemblies.

Table of Contents:
Preface 10 Rules of Machine SolderingAcknowledgments1 Soldering Process Time on its Side Printed Circuit Board Soldering Soldering Processes Component/Solder (CS) Processes Solder/Component (SC) Processes — 'Reflow' Soldering Cleaning Quality Safety2 Electronics Assemblies Joints Through-Hole Joints Surface Mounted Components Surface Mounted Joints Assembly Variations Assembly Classification Solder Paste or Adhesive Application3 Solder Metallurgical Properties of Tin/Lead Alloys The Soldered Joint Solderability Protective Coatings4 Flux Need for Flux How Fluxes Work Categorization of Fluxes Choosing a Flux Application of Fluxes5 CS soldering Processes Hand Soldering Mass CS Soldering Processes Inert Atmosphere Soldering Handling Assemblies Solder Pots and Pumps Solder Pot Heaters Soldering6 SC soldering Processes Heat Application Infra-Red Soldering Preheating Temperature Differentials Profiles Hot Vapor Soldering Laser Soldering Light Beam Soldering Heated Collet or Hot Bar Miscellaneous SC Soldering Processes Comparison of Soldering Processes7 Cleaning of Soldered Assemblies The Montreal Protocol Why Clean at All? Contamination Classifications of Cleaner Cleaning Processes Contamination Testing Comparing the Cleaning Options8 Avoiding Problems — Soldering Quality Have Problems Occurred? Statistical Process Control Solutions to Problems9 Standards & Specifications Why Comply with Standards Reference to Standards Levels of Standards Standards Organizations and Bodies Standards for Electronics Assembly Manufacture Guide to Relevant Worldwide StandardsGlossaryReferencesFurther ReadingWorldwide AddressesAppendix 1 Why not Blame the Machine?Appendix 2 Problems & SolutionsAppendix 3 Soldering SafetyAppendix 4 Comparing Soldering Processes & MachinesIndex


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Product Details
  • ISBN-13: 9780750605892
  • Publisher: Elsevier Science & Technology
  • Publisher Imprint: Newnes (an imprint of Butterworth-Heinemann Ltd )
  • Language: English
  • ISBN-10: 0750605898
  • Publisher Date: 05 Nov 1992
  • Binding: Hardback
  • No of Pages: 300


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