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B Keser

B Keser

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1.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces37 % NR
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, B Keser
Publisher: John Wiley and Sons Ltd
No Review Yet
₹13,978
₹8,806
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies9 % NR
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
By: Beth Keser, Steffen Kroehnert, Steffen Kröhnert, Keser, B Keser
Publisher: Wiley-IEEE Press
No Review Yet
₹13,742
₹12,505
Binding:
Hardback
Release:
12 Feb 2019
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
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