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Chong Leong Gan

Chong Leong Gan

4 results found
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1.
Electronic Materials Innovations and Reliability in Advanced Memory PackagingNR
Electronic Materials Innovations and Reliability in Advanced Memory Packaging
By: Chen Yu Huang, Chong Leong Gan
Publisher: Springer International Publishing AG
No Review Yet
₹16,333
Binding:
Hardback
Release:
22 Jul 2025
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Interconnect Reliability in Advanced Memory Device Packaging2 % NR
Interconnect Reliability in Advanced Memory Device Packaging
By: Gan Chong Leong Gan, Huang Chen-Yu Huang
Publisher: Springer Nature B.V.
No Review Yet
₹4,999
₹4,899
Binding:
Paperback
Release:
29 Apr 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Interconnect Reliability in Advanced Memory Device PackagingNR
Interconnect Reliability in Advanced Memory Device Packaging
By: Chen-Yu, Huang, Chong Leong, Gan
Publisher: Springer International Publishing AG
No Review Yet
₹21,104
Binding:
Hardback
Release:
29 Apr 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
4.
Interconnect Reliability in Advanced Memory Device Packaging37 %
Interconnect Reliability in Advanced Memory Device Packaging
By: Chen-Yu, Huang, Chong Leong, Gan
Publisher: Springer International Publishing AG
No Review Yet
₹22,299
₹14,048
Binding:
Paperback
Release:
30 Apr 2024
Language:
English
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