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D. Agonafer

D. Agonafer

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1.
Thermal Management of Microelectronic EquipmentPOD/NR
Thermal Management of Microelectronic Equipment
By: Lian-Tuu Yeh, D. Agonafer
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
₹16,224
Binding:
Hardback
Release:
01 Jun 2016
Language:
English
International Edition
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Application of CAE/CAD to Electronic Systems
Application of CAE/CAD to Electronic Systems
By: D.; Fulton Agonafer
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
₹6,452
Binding:
Hardback
Release:
01 Jan 1996
Language:
English
Out of Stock
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3.
Application of Heat Transfer in Microelectronic Packaging
Application of Heat Transfer in Microelectronic Packaging
By: Et Al, D. Agonafer, C.H. Amon
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
₹7,303
Binding:
Hardback
Release:
01 Jan 1997
Language:
English
Out of Stock
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