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Ephraim Suhir

Ephraim Suhir

12 results found
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1.
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices43 %
Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
₹14,980
₹8,539
Binding:
Hardback
Release:
28 Jan 2021
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Human-in-the-Loop43 %
Human-in-the-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: CRC Press
No Review Yet
₹16,050
₹9,149
Binding:
Hardback
Release:
05 Apr 2018
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 22638 %
Mechanical Behavior of Materials and Structures in Microelectronics: Volume 226
By: Ephraim Suhir, Robert C Cammarata, Deborah D L Chung, Masahiro Jono
Publisher: Cambridge University Press
No Review Yet
₹3,546
₹2,199
Binding:
Hardback
Release:
01 Jan 1991
Language:
English
Available
Ships within 1-2 Days Explain..
4.
Structural Analysis in Microelectronic and Fiber-Optic Systems37 %
Structural Analysis in Microelectronic and Fiber-Optic Systems
By: Ephraim Suhir
Publisher: Springer
No Review Yet
₹4,690
₹2,955
Binding:
Paperback
Release:
17 Feb 2012
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Moisture Sensitivity of Plastic Packages of IC Devices37 %
Moisture Sensitivity of Plastic Packages of IC Devices
By: E. Suhir, X.J. Fan, Ephraim Suhir, X. J. Fan, X J Fan
Publisher: Springer
No Review Yet
₹23,450
₹14,774
Binding:
Hardback
Release:
19 Jul 2010
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging64 %
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, Y C Lee, C P Wong
Publisher: Springer
No Review Yet
₹56,100
₹20,196
Binding:
Hardback
Release:
01 Oct 2006
Language:
English
Available
Ships within 2-4 Days Explain..
7.
Human-In-The-Loop7 % NR
Human-In-The-Loop
By: Ephraim Suhir, Ephraim (Portland State University, Portland, USA) Suhir
Publisher: Taylor and Francis
No Review Yet
₹5,036
₹4,683
Binding:
Paperback
Release:
02 Apr 2021
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Structural Dynamics of Electronic and Photonic Systems11 % NR
Structural Dynamics of Electronic and Photonic Systems
By: Eric Connally, Ephraim Suhir, David S. Steinberg, T. X. Yu , T X Yu
Publisher: Wiley
No Review Yet
₹17,888
₹15,920
Binding:
Hardback
Release:
03 May 2011
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
9.
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging37 %
Micro- And Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
By: Y.C. Lee, C.P. Wong, Ephraim Suhir, C.P. Wong (Editor), Ephraim Suhir (Editor)
Publisher: Springer
No Review Yet
₹46,900
₹29,547
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Out of Stock
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10.
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
Reliability of Photonics Materials and Structures: Symposium Held April 13-16, 1998, San Francisco, California, U.S.A (Materials Research Society Symposium Proceedings)
By: Fukuda, Mitsuo, Kurkjian, Charles R., Suhir, Ephraim
Publisher: Materials Research Society
No Review Yet
₹7,637
Binding:
Hardcover
Release:
01-Oct-1998
Language:
English
Out of Stock
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11.
Structural Dynamics of Electronic and Photonic Systems4 % NR
Structural Dynamics of Electronic and Photonic Systems
By: Ephraim Suhir, T X Yu, David S Steinberg
Publisher: Wiley
No Review Yet
₹14,440
₹13,929
Binding:
Online resource
Release:
08 Apr 2011
Language:
English
Out of Stock
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12.
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging37 % NR
Proceedings of the Pacific Rim/ASME International Intersociety Electronic and Photonic Packaging Conference and Exhibition Interpack 97;Advances in Electronic Packaging
By: Au, Ephraim Suhir, M. Shiratori
Publisher: American Society Of Mechanical Engineers,u.s.
No Review Yet
₹47,806
₹30,118
Binding:
Hardback
Release:
15 Jun 1997
Out of Stock
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