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Guoli Sun

Guoli Sun

Guoli Sun is currently pursuing a Ph.D. at Harbin Institute of Technology, where his research focuses on material and structural reliability in advanced electronic packaging, as well as the mechanical characterization and performance analysis of vrious materials.

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Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging17 % NR
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₹13,725
₹11,392
Binding:
Hardback
Release:
01 Jul 2025
Language:
English
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