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Ibrahim (Abe) M Elfadel

Ibrahim (Abe) M Elfadel

11 results found
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1.
MEMS Accelerometers26 % POD/NR
MEMS Accelerometers
By: Ibrahim (Abe) M Elfadel, Ha Duong Ngo, Mahmoud Rasras
Publisher: Mdpi AG
No Review Yet
₹6,090
₹4,507
Binding:
Paperback
Release:
27 May 2019
Language:
English
International Edition
Ships within 14-16 Days Explain..
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Secure, Low-Power Iot Communication Using Edge-Coded Signaling37 %
Secure, Low-Power Iot Communication Using Edge-Coded Signaling
By: Ibrahim (Abe) M. Elfadel, Shahzad Muzaffar, Elfadel
Publisher: Springer Nature Switzerland AG
No Review Yet
₹7,973
₹5,023
Binding:
Hardback
Release:
07 May 2022
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things37 %
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
By: Ibrahim (Abe) M. Elfadel, H. Fatih Ugurdag, Ricardo Reis, Matteo Sonza Reorda, Jose Monteiro
Publisher: Springer International Publishing
No Review Yet
₹5,159
₹3,250
Binding:
Paperback
Release:
14 Aug 2020
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Iot Physical Layer37 %
Iot Physical Layer
By: Ibrahim (Abe) M. Elfadel, Mohammed Ismail, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
₹12,194
₹7,682
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Machine Learning in VLSI Computer-Aided Design37 %
Machine Learning in VLSI Computer-Aided Design
By: Ibrahim (Abe) M. Elfadel, Xin Li, Duane S. Boning, Duane S Boning, Ibrahim (Abe) M Elfadel
Publisher: Springer
No Review Yet
₹16,884
₹10,637
Binding:
Hardback
Release:
27 Mar 2019
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things37 %
Vlsi-Soc: Opportunities and Challenges Beyond the Internet of Things
By: Ibrahim (Abe) M. Elfadel, H. Fatih Ugurdag, Ricardo Reis, Matteo Sonza Reorda, Jose Monteiro
Publisher: Springer
No Review Yet
₹7,317
₹4,610
Binding:
Hardback
Release:
03 Jul 2019
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Iot Physical Layer37 %
Iot Physical Layer
By: Ibrahim (Abe) M. Elfadel, Mohammed Ismail, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
₹9,380
₹5,909
Binding:
Hardback
Release:
13 Sep 2018
Language:
English
Available
Ships within 12-14 Days Explain..
8.
3D Stacked Chips37 %
3D Stacked Chips
By: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
₹4,690
₹2,955
Binding:
Paperback
Release:
26 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
9.
3D Stacked Chips37 %
3D Stacked Chips
By: Ibrahim (Abe) M. Elfadel, Gerhard Fettweis, Ibrahim M. Elfadel, Ibrahim (Abe) M Elfadel, Elfadel
Publisher: Springer
No Review Yet
₹4,690
₹2,955
Binding:
Hardback
Release:
23 May 2016
Language:
English
Available
Ships within 12-14 Days Explain..
10.
VLSI-SoC3 % NR
VLSI-SoC
By: Sonza Reorda Matteo Sonza Reorda, Maniatakos Michail Maniatakos, Elfadel Ibrahim (Abe) M. Elfadel
Publisher: Springer Nature B.V.
No Review Yet
₹4,239
₹4,112
Binding:
Paperback
Release:
20 May 2019
Language:
English
Out of Stock
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11.
The IoT Physical Layer1 % NR
The IoT Physical Layer
By: Ismail Mohammed Ismail, Elfadel Ibrahim (Abe) M. Elfadel
Publisher: Springer Nature B.V.
No Review Yet
₹4,239
₹4,197
Binding:
Paperback
Release:
06 Sep 2018
Language:
English
Out of Stock
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