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1.
Handbook of Wafer Bonding20 % POD/NR
Handbook of Wafer Bonding
By: Maaike M. V. Taklo, James Jian-Qiang Lu, Peter Ramm
Publisher: Wiley-VCH Verlag GmbH
No Review Yet
₹16,107
₹12,886
Binding:
Hardback
Release:
11 Jan 2012
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Handbook of Wafer Bonding
Handbook of Wafer Bonding
By: James Jian-Qiang Lu, Peter Ramm
Publisher: Wiley-vch
No Review Yet
₹0
Binding:
Digital (delivered electronically)
Release:
01 Jan 2011
Out of Stock
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3.
Handbook of Wafer Bonding
Handbook of Wafer Bonding
By: Maaike M. V. Taklo, James Jian-Qiang Lu, Peter Ramm
Publisher: John Wiley and Sons Ltd
No Review Yet
₹19,470
Binding:
Digital (delivered electronically)
Release:
17 Nov 2011
Language:
English
Out of Stock
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4.
Handbook of Wafer Bonding
Handbook of Wafer Bonding
By: Maaike M. V. Taklo, James Jian-Qiang Lu, Peter Ramm
Publisher: John Wiley and Sons Ltd
No Review Yet
₹19,470
Binding:
Digital (delivered electronically)
Release:
28 Nov 2011
Language:
English
Out of Stock
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5.
Handbook of Wafer Bonding
Handbook of Wafer Bonding
By: Maaike M. V. Taklo, James Jian-Qiang Lu, Peter Ramm
Publisher: John Wiley and Sons Ltd
No Review Yet
₹19,470
Binding:
Digital (delivered electronically)
Release:
18 May 2011
Language:
English
Out of Stock
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