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Joshua Ravich

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1.

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

48 %

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo

Publisher: Taylor & Francis Ltd

No Review Yet

₹5,703

₹2,966

Binding:	Paperback
Release:	26 Aug 2024
Language:	English

Available

Ships within 20-22 Days Explain..

2.

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

48 %

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo

Publisher: Taylor & Francis Ltd

No Review Yet

₹14,260

₹7,415

Binding:	Hardback
Release:	30 Dec 2021
Language:	English

Available

Ships within 20-22 Days Explain..

3.

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo

Publisher: Taylor & Francis Ltd

No Review Yet

₹4,962

Binding:	Digital (delivered electronically)
Release:	29 Dec 2021
Language:	English

Out of Stock

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4.

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments

By: Jeremiah Gayle, Joshua Ravich, Juan Cepeda-Rizo

Publisher: Taylor & Francis Ltd

No Review Yet

₹4,962

Binding:	Digital (delivered electronically)
Release:	29 Dec 2021
Language:	English

Out of Stock

Notify me when this book is in stockNotify Me

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