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King Ning Tu

King Ning Tu

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1.
Electronic Packaging Science and Technology14 % NR
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₹19,438
₹16,717
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
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2.
Elements of Electromigration47 %
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₹11,744
₹6,224
Binding:
Hardback
Release:
19 Jan 2024
Language:
English
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3.
Solder Joint Technology37 %
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₹24,639
₹15,523
Binding:
Paperback
Release:
19 Nov 2010
Language:
English
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4.
Solder Joint Technology
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₹11,765
Binding:
Hardback
Release:
22 Aug 2007
Language:
English
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5.
Electronic Packaging Materials Science VIII: Volume 390
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6.
Elements of ElectromigrationNR
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₹6,769
Binding:
Paperback
Release:
25 Dec 2025
Language:
English
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7.
Understanding the Reliability Technology Based on Entropy Production, and Other Researches17 % NR
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₹18,050
₹14,982
Binding:
Paperback
Release:
15 May 2021
Language:
English
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8.
Electronic Thin-Film Reliability4 % NR
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₹8,118
₹7,793
Binding:
Hardback
Release:
25 Nov 2010
Language:
English
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9.
Kinetics in Nanoscale Materials49 % NR
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₹15,262
₹7,784
Binding:
Hardback
Release:
11 Jul 2014
Language:
English
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10.
Silicon and Silicide Nanowires31 % NR
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₹15,280
₹10,543
Binding:
Hardback
Release:
24 Oct 2013
Language:
English
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11.
Elements of Electromigration
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₹5,388
Binding:
Digital (delivered electronically)
Release:
19 Jan 2024
Language:
English
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12.
Elements of Electromigration
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₹5,388
Binding:
Digital (delivered electronically)
Release:
19 Jan 2024
Language:
English
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13.
Electronic Packaging Science and Technology
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₹17,305
Binding:
Other digital
Release:
17 Dec 2021
Language:
English
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14.
Silicon and Silicide Nanowires
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₹12,305
Binding:
Digital (delivered electronically)
Release:
19 Apr 2016
Language:
English
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15.
Electronic Thin-Film Reliability
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₹0
Binding:
Digital download and online
Release:
01 Dec 2010
Language:
English
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16.
Advanced Interconnects and Contacts: Volume 564NR
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