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King Ning Tu

King Ning Tu

16 results found
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1.
Electronic Packaging Science and Technology14 % NR
Electronic Packaging Science and Technology
By: King-Ning Tu, Chih Chen, Hung-Ming Chen
Publisher: John Wiley & Sons Inc
No Review Yet
₹18,619
₹16,012
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Elements of Electromigration48 %
Elements of Electromigration
By: King-Ning Tu, Yingxia Liu
Publisher: Taylor & Francis Ltd
No Review Yet
₹11,339
₹5,896
Binding:
Hardback
Release:
19 Jan 2024
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Solder Joint Technology37 %
Solder Joint Technology
By: King-Ning Tu
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹23,869
₹15,037
Binding:
Paperback
Release:
19 Nov 2010
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Silicon and Silicide Nanowires32 %
Silicon and Silicide Nanowires
By: King-Ning Tu, Yu Huang
Publisher: Pan Stanford Publishing Pte Ltd
No Review Yet
₹14,880
₹10,118
Binding:
Hardback
Release:
24 Oct 2013
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Solder Joint Technology
Solder Joint Technology
By: King-Ning Tu
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹10,932
Binding:
Hardback
Release:
22 Aug 2007
Language:
English
Available
Ships within 8-10 Days Explain..
6.
Electronic Packaging Materials Science VIII: Volume 390
Electronic Packaging Materials Science VIII: Volume 390
By: Robert C. Sundahl, King-Ning Tu, Kenneth A. Jackson, Peter Børgesen
Publisher: Materials Research Society
No Review Yet
₹2,385
Binding:
Hardback
Release:
26 Sep 1995
Language:
English
Available
Ships within 8-10 Days Explain..
7.
Understanding the Reliability Technology Based on Entropy Production, and Other Researches18 % NR
Understanding the Reliability Technology Based on Entropy Production, and Other Researches
By: King-Ning Tu
Publisher: Independently Published
No Review Yet
₹17,577
₹14,413
Binding:
Paperback
Release:
15 May 2021
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Elements of Electromigration1 % NR
Elements of Electromigration
By: King-Ning Tu, Yingxia Liu
No Review Yet
₹6,624
₹6,558
Binding:
Paperback
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
9.
Electronic Thin-Film Reliability4 % NR
Electronic Thin-Film Reliability
By: King-Ning Tu
Publisher: Cambridge University Press
No Review Yet
₹7,533
₹7,232
Binding:
Hardback
Release:
25 Nov 2010
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
10.
Kinetics in Nanoscale Materials49 % NR
Kinetics in Nanoscale Materials
By: King-Ning Tu, Andriy M. Gusak
Publisher: John Wiley & Sons Inc
No Review Yet
₹14,619
₹7,456
Binding:
Hardback
Release:
11 Jul 2014
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
11.
Elements of Electromigration
Elements of Electromigration
By: King-Ning Tu, Yingxia Liu
Publisher: Taylor & Francis eBooks
No Review Yet
₹5,388
Binding:
Digital (delivered electronically)
Release:
19 Jan 2024
Language:
English
Out of Stock
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12.
Elements of Electromigration
Elements of Electromigration
By: King-Ning Tu, Yingxia Liu
Publisher: Taylor & Francis eBooks
No Review Yet
₹5,388
Binding:
Digital (delivered electronically)
Release:
19 Jan 2024
Language:
English
Out of Stock
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13.
Electronic Packaging Science and Technology
Electronic Packaging Science and Technology
By: King-Ning Tu, Chih Chen, Hung-Ming Chen
Publisher: John Wiley and Sons Ltd
No Review Yet
₹17,305
Binding:
Other digital
Release:
17 Dec 2021
Language:
English
Out of Stock
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14.
Silicon and Silicide Nanowires
Silicon and Silicide Nanowires
By: King-Ning Tu, Yu Huang
Publisher: Pan Stanford Publishing Pte Ltd
No Review Yet
₹12,305
Binding:
Digital (delivered electronically)
Release:
19 Apr 2016
Language:
English
Out of Stock
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15.
Advanced Interconnects and Contacts: Volume 564NR
Advanced Interconnects and Contacts: Volume 564
By: Daniel C. Edelstein, King-Ning Tu, Takamaro Kikkawa, Elizabeth J. Weitzman, Mehmet C. Öztürk
Publisher: Materials Research Society
No Review Yet
₹2,715
Binding:
Hardback
Release:
07 Oct 1999
Language:
English
Out of Stock
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