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Krishna Tunga

Krishna Tunga

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1.
Study of SnAgCu Alloy Reliability14 % POD/NR
Study of SnAgCu Alloy Reliability
By: Krishna Tunga
Publisher: VDM Verlag
No Review Yet
₹6,943
₹5,971
Binding:
Paperback
Release:
15 Mar 2009
Language:
English
International Edition
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry
Study of Tin-Silver-Copper Alloy Reliability Through Material Microstructure Evolution and Laser Moire Interferometry
By: Krishna Rajaram Tunga
Publisher: Proquest, Umi Dissertation Publishing
No Review Yet
₹6,347
Binding:
Paperback
Release:
01 Oct 2011
Language:
English
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