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1.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG
Publisher: John Wiley & Sons Inc
No Review Yet
₹6,817
Binding:
Hardback
Release:
19 Jun 2018
Language:
English
Available
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2.
3D IC and RF SiPs – Advanced Stacking and Planar Solutions for 5G Mobility
3D IC and RF SiPs – Advanced Stacking and Planar Solutions for 5G Mobility
By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG
Publisher: John Wiley and Sons Ltd
No Review Yet
₹11,240
Binding:
Other digital
Release:
31 Mar 2018
Language:
English
Out of Stock
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3.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG
Publisher: John Wiley & Sons Inc
No Review Yet
₹0
Binding:
Digital (delivered electronically)
Release:
29 Mar 2018
Language:
English
Out of Stock
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4.
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG
Publisher: John Wiley & Sons Inc
No Review Yet
₹0
Binding:
Digital (delivered electronically)
Release:
28 Mar 2018
Language:
English
Out of Stock
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