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1.

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG

Publisher: John Wiley & Sons Inc

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₹6,565

Binding:	Hardback
Release:	19 Jun 2018
Language:	English

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2.

3D IC and RF SiPs – Advanced Stacking and Planar Solutions for 5G Mobility

3D IC and RF SiPs – Advanced Stacking and Planar Solutions for 5G Mobility

By: Tzyy-sheng Jason Horng, LIH-TYNG HWANG

Publisher: John Wiley and Sons Ltd

No Review Yet

₹11,240

Binding:	Other digital
Release:	31 Mar 2018
Language:	English

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