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Michael G. Pecht

Michael G. Pecht

26 results found
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1.
Influence of Temperature on Microelectronics and System Reliability59 %
Influence of Temperature on Microelectronics and System Reliability
By: Michael Pecht, Edward B. Hakim, Michael G. Pecht, Pradeep Lall, Michael G Pecht
Publisher: CRC Press
No Review Yet
₹13,785
₹5,652
Binding:
Hardback
Release:
24 Apr 1997
Language:
English
Available
Ships within 4-6 Days Explain..
2.
Lead-Free Electronics10 % POD/NR
Lead-Free Electronics
By: Sanka Ganesan, Ganesan, Michael G. Pecht, Michael G Pecht, Pecht
Publisher: Wiley-Interscience
No Review Yet
₹15,259
₹13,733
Binding:
Hardback
Release:
01 Mar 2006
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Risk-Based Engineering37 %
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde, Michael G (University of Maryland) Pecht
Publisher: Springer
No Review Yet
₹8,442
₹5,318
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Risk-Based Engineering41 % POD/NR
Risk-Based Engineering
By: Michael G. Pecht, Prabhakar V. Varde, Michael G Pecht, Prabhakar V Varde
Publisher: Springer
No Review Yet
₹11,659
₹6,879
Binding:
Hardback
Release:
24 Aug 2018
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
5.
Placement and Routing of Electronic Modules22 %
Placement and Routing of Electronic Modules
By: Pecht Pecht, Michael Pecht, Michael G Pecht, Michael (University of Maryland, College Park, USA) Pecht, M Pecht
Publisher: CRC Press
No Review Yet
₹11,706
₹9,131
Binding:
Hardback
Release:
12 Mar 1993
Language:
English
Available
Ships within 4-6 Days Explain..
6.
Guidebook for Managing Silicon Chip Reliability43 %
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael (University of Maryland, College Park, USA) Pecht
Publisher: Taylor & Francis Inc
No Review Yet
₹6,892
₹3,928
Binding:
Hardback
Release:
29 Dec 1998
Language:
English
Available
Ships within 1-2 Days Explain..
7.
Singapore and Malaysia Electronics Industries43 %
Singapore and Malaysia Electronics Industries
By: Donald Beane, Pecht Michael G., Anand Shukla
Publisher: CRC Press
No Review Yet
₹3,281
₹1,870
Binding:
Paperback
Release:
1997
Language:
English
Available
Ships within 4-6 Days Explain..
8.
Optimum Cooling of Data Centers37 %
Optimum Cooling of Data Centers
By: Diganta Das, Diganta Bhusan Das, Michael G. Pecht, Michael M. Ohadi, Jun Dai
Publisher: Springer
No Review Yet
₹9,380
₹5,909
Binding:
Paperback
Release:
20 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Optimum Cooling of Data Centers37 %
Optimum Cooling of Data Centers
By: Diganta Das, Diganta Bhusan Das, Michael G. Pecht, Michael M. Ohadi, Jun Dai
Publisher: Springer
No Review Yet
₹9,380
₹5,909
Binding:
Hardback
Release:
21 Nov 2013
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Copper Wire Bonding37 %
Copper Wire Bonding
By: Zhaowei Zhong, Zhaowei W. Zhong, Michael G. Pecht, Preeti S. Chauhan, Anupam Choubey
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹12,194
₹7,682
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Copper Wire Bonding33 %
Copper Wire Bonding
By: Zhaowei Zhong, Zhaowei W. Zhong, Michael G. Pecht, Preeti S. Chauhan, Anupam Choubey
Publisher: Springer
No Review Yet
₹11,315
₹7,581
Binding:
Hardback
Release:
20 Sep 2013
Language:
English
Available
Ships within 2-4 Days Explain..
12.
Electronic Packaging Materials and Their Properties43 %
Electronic Packaging Materials and Their Properties
By: Patrick McCluskey, Rakesh Agarwal, Michael G. (EDT) Pecht, Terrance Dishongh, Sirus Javadpour
Publisher: Taylor & Francis Inc
No Review Yet
₹16,050
₹9,149
Binding:
Hardback
Release:
18 Dec 1998
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Nature-Inspired Computing Paradigms in Systems19 % NR
Nature-Inspired Computing Paradigms in Systems
By: Michael Pecht, Mohamed Arezki Mellal, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Michael M Pecht
Publisher: Elsevier Science
No Review Yet
₹10,427
₹8,446
Binding:
Paperback
Release:
01 Jul 2021
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
14.
Electrical Connectors11 % NR
Electrical Connectors
By: Michael G. Pecht, Michael G Pecht, San Kyeong, S Kyeong, Michael G. (University of Maryland) Pecht
Publisher: Wiley
No Review Yet
₹12,185
₹10,845
Binding:
Hardback
Release:
29 Dec 2020
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
15.
Influence of Temperature on Microelectronics and System Reliability36 % NR
Influence of Temperature on Microelectronics and System Reliability
By: Michael Pecht, Edward B. Hakim, Michael G. Pecht, Pradeep Lall, Michael G Pecht
Publisher: Taylor and Francis
No Review Yet
₹6,716
₹4,298
Binding:
Paperback
Release:
21 Jun 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
16.
Guidebook for Managing Silicon Chip Reliability37 % POD/NR
Guidebook for Managing Silicon Chip Reliability
By: Michael Pecht, Riko Radojcic, Gopal Rao, Michael G. Pecht, Michael G Pecht
Publisher: Taylor and Francis
No Review Yet
₹6,716
₹4,231
Binding:
Paperback
Release:
07 Oct 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
17.
Prognostics and Health Management of Electronics17 % POD/NR
Prognostics and Health Management of Electronics
By: Michael G. Pecht, Myeongsu Kang, Michael G Pecht, MG Pecht, Michael G. (University of Maryland) Pecht
Publisher: Wiley-IEEE Press
No Review Yet
₹14,276
₹11,849
Binding:
Hardback
Release:
01 Oct 2018
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
18.
Encapsulation Technologies for Electronic Applications16 % POD/NR
Encapsulation Technologies for Electronic Applications
By: Haleh Ardebili, Michael Pecht, Michael G Pecht, James J Licari, Jiawei Zhang
Publisher: William Andrew
No Review Yet
₹19,740
₹16,582
Binding:
Paperback
Release:
11 Oct 2018
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
19.
Soldering Processes and Equipment17 % POD/NR
Soldering Processes and Equipment
By: Michael Pecht, Michael G Pecht, Pecht, MG Pecht, Michael (University of Maryland, College Park) Pecht
Publisher: Wiley-Interscience
No Review Yet
₹14,948
₹12,407
Binding:
Hardback
Release:
18 Jun 1993
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
20.
China's Electronics Industry36 % POD/NR
China's Electronics Industry
By: Michael Pecht, Michael G Pecht, Michael (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht, Michael M Pecht, Michael M. (CALCE (Center for Advanced Life Cycle Engineering), University of Maryland, USA) Pecht
Publisher: William Andrew
No Review Yet
₹38,220
₹24,461
Binding:
Paperback
Release:
31 Dec 2006
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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