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Michael G. Pecht

Michael G. PechtHe is the founder and director of CALCE (Center for Advanced Life Cycle Engineering) at the University of Maryland, which is funded by over 150 of the world’s leading electronics companies at more than US$6M/year. He is a Professional Engineer, an IEE Fellow, an ASME Fellow, an SAE Fellow, and an IMAPS Fellow. He is currently serving as editor-in-chief of Circuit World. He served as editor-in-chief of IEEE Access for 6 years, as editor-in-chief of IEEE Transactions on Reliability for 9 years, and as editor-in-chief of Microelectronics Reliability for 16 years. He has also served on three U.S. National Academy of Science studies, two U.S. Congressional investigations in automotive safety, and as an expert to the U.S. FDA. He is also a Chair Professor. He consults for 22 major international electronics companies, providing expertise in strategic planning, design, test, prognostics, IP and risk assessment of electronic products and systems. Read More Read Less

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1.
Electrical Connectors9 % NR
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₹14,024
₹12,762
Binding:
Hardback
Release:
29 Jan 2021
Language:
English
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3.
Risk-Based Engineering37 %
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₹9,854
₹6,208
Binding:
Paperback
Release:
19 Jan 2019
Language:
English
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4.
Risk-Based Engineering37 %
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₹14,234
₹8,967
Binding:
Hardback
Release:
01 May 2018
Language:
English
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6.
Nature-Inspired Computing Paradigms in Systems45 %
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₹11,220
₹6,171
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Paperback
Release:
18 Jun 2021
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English
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7.
China's Electronics Industry45 %
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₹42,543
₹23,399
Binding:
Paperback
Release:
10 Aug 2006
Language:
English
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8.
IC Component Sockets45 %
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₹12,805
₹7,043
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Hardback
Release:
16 Apr 2004
Language:
English
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9.
Parts Selection and Management
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₹8,008
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Hardback
Release:
25 Feb 2004
Language:
English
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10.
Prognostics and Health Management of Electronics
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₹8,747
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Hardback
Release:
07 Sep 2018
Language:
English
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11.
Optimum Cooling of Data Centers37 %
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₹10,949
₹6,898
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Paperback
Release:
20 Aug 2016
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English
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12.
Optimum Cooling of Data Centers37 %
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₹10,949
₹6,898
Binding:
Hardback
Release:
21 Nov 2013
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English
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13.
Encapsulation Technologies for Electronic Applications45 %
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₹21,973
₹12,085
Binding:
Hardback
Release:
22 Jul 2009
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English
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14.
Encapsulation Technologies for Electronic Applications45 %
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₹21,973
₹12,085
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Paperback
Release:
11 Oct 2018
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English
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15.
Copper Wire Bonding37 %
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₹14,234
₹8,967
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Paperback
Release:
23 Aug 2016
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English
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16.
Copper Wire Bonding37 %
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₹14,234
₹8,967
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Hardback
Release:
20 Sep 2013
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English
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17.
The Safety Challenges and Strategies of Using Lithium-Ion Batteries13 % NR
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₹14,391
₹12,520
Binding:
Hardback
Release:
26 Sep 2025
Language:
English
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