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Rao R. Tummala

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1.

Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition

Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition

By: Tummala, Rao R.

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₹861

Binding:	Paperback
Language:	English

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2.

Microelectronics Packaging Handbook

9 % NR

Microelectronics Packaging Handbook

By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski

Publisher: Van Nostrand Reinhold Inc.,U.S.

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₹6,840

₹6,228

Binding:	Hardback
Release:	15 Sep 1996
Language:	English

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