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Seonho Seok

Seonho Seok

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1.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
No Review Yet
₹15,189
₹9,569
Binding:
Hardback
Release:
14 May 2018
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering37 %
No Review Yet
₹15,189
₹9,569
Binding:
Paperback
Release:
05 Jan 2019
Language:
English
Available
Ships within 14-16 Days Explain..
3.
MEMS Packaging Technologies and 3D Integration23 % NR
Publisher: Mdpi AG
No Review Yet
₹7,072
₹5,445
Binding:
Hardback
Release:
01 Jun 2022
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
4.
Advanced Packaging and Manufacturing Technology Based on Adhesion EngineeringNR
No Review Yet
₹4,323
Binding:
Paperback
Release:
03 May 2018
Language:
English
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