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Ulrich Gösele

Ulrich Gösele

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1.
Wafer Bonding11 % POD/NR
Wafer Bonding
By: Marin Alexe, Ulrich Gösele
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹37,974
₹33,797
Binding:
Hardback
Release:
14 May 2004
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Wafer Bonding11 % POD/NR
Wafer Bonding
By: Marin Alexe, Ulrich Gösele
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹37,974
₹33,797
Binding:
Paperback
Release:
30 Sep 2011
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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