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William I. Ko

William I. Ko

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1.
Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating2 % POD/NR
Thermal Buckling Analysis of Rectangular Panels Subjected to Humped Temperature Profile Heating
By: William I Ko
Publisher: Bibliogov
No Review Yet
₹1,580
₹1,548
Binding:
Paperback
Release:
02 Aug 2013
Language:
English
International Edition
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Proceedings of the Twenty-Second Annual Convention of the American Cotton Manufacturers Association: Held at New York, May 1, 2 and 3, 1918, Biltmore Hotel; Together With Certificate of Incorporation and by-Laws (Classic Reprint)NR
Proceedings of the Twenty-Second Annual Convention of the American Cotton Manufacturers Association: Held at New York, May 1, 2 and 3, 1918, Biltmore Hotel; Together With Certificate of Incorporation and by-Laws (Classic Reprint)
By: William I. Ko
Publisher: Forgotten Books
No Review Yet
₹3,054
Binding:
Hardback
Release:
30 Sep 2018
Language:
English
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