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Xingcun Colin Tong

Xingcun Colin Tong

7 results found
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1.
Advanced Materials for Thermal Management of Electronic Packaging37 %
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹26,539
₹16,720
Binding:
Hardback
Release:
10 Jan 2011
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong
Publisher: Springer International Publishing AG
No Review Yet
₹18,047
₹11,370
Binding:
Paperback
Release:
22 Aug 2018
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Advanced Materials and Design for Electromagnetic Interference Shielding41 %
Advanced Materials and Design for Electromagnetic Interference Shielding
By: Xingcun Colin Tong
Publisher: Taylor & Francis Inc
No Review Yet
₹21,473
₹12,669
Binding:
Hardback
Release:
19 Nov 2008
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong
Publisher: Springer International Publishing AG
No Review Yet
₹18,047
₹11,370
Binding:
Hardback
Release:
22 Sep 2017
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Advanced Materials for Integrated Optical Waveguides37 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph.D
Publisher: Springer International Publishing AG
No Review Yet
₹15,923
₹10,031
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Advanced Materials for Integrated Optical Waveguides59 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph.D
Publisher: Springer International Publishing AG
No Review Yet
₹19,108
₹7,834
Binding:
Hardback
Release:
30 Oct 2013
Language:
English
Available
Ships within 1-2 Days Explain..
7.
Advanced Materials for Thermal Management of Electronic Packaging39 % NR
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹26,539
₹16,189
Binding:
Paperback
Release:
25 Feb 2013
Language:
English
International Edition
Ships within 12-14 Days Explain..
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