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Xingcun Colin Tong

Xingcun Colin Tong

7 results found
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1.
Advanced Materials for Thermal Management of Electronic Packaging37 %
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹24,999
₹15,749
Binding:
Hardback
Release:
10 Jan 2011
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Advanced Materials for Thermal Management of Electronic Packaging37 %
Advanced Materials for Thermal Management of Electronic Packaging
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹24,999
₹15,749
Binding:
Paperback
Release:
25 Feb 2013
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer
No Review Yet
₹16,999
₹10,709
Binding:
Hardback
Release:
22 Sep 2017
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Functional Metamaterials and Metadevices37 %
Functional Metamaterials and Metadevices
By: Xingcun Colin Tong, Xingcun Colin, Ph.D. Tong
Publisher: Springer International Publishing AG
No Review Yet
₹16,999
₹10,709
Binding:
Paperback
Release:
22 Aug 2018
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Advanced Materials for Integrated Optical Waveguides59 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph D, Xingcun Colin, Ph.D. Tong, Xingcun Colin Tong Ph.D
Publisher: Springer
No Review Yet
₹18,053
₹7,402
Binding:
Hardback
Release:
30 Oct 2013
Language:
English
Available
Ships within 1-2 Days Explain..
6.
Advanced Materials for Integrated Optical Waveguides37 %
Advanced Materials for Integrated Optical Waveguides
By: Xingcun Colin Tong Ph D, Xingcun Colin, Ph.D. Tong, Xingcun Colin Tong Ph.D
Publisher: Springer
No Review Yet
₹14,999
₹9,449
Binding:
Paperback
Release:
23 Aug 2016
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Advanced Materials and Design for Electromagnetic Interference Shielding41 %
Advanced Materials and Design for Electromagnetic Interference Shielding
By: Colin Tong, Xingcun Colin Tong, Xingcun Tong, Xingcun Colin, Ph.D. Tong, Xingcun Colin, Ph.D. (Laird Technologies, Schaumburg, Illinois, USA) Tong
Publisher: CRC Press
No Review Yet
₹20,650
₹12,184
Binding:
Hardback
Release:
19 Nov 2008
Language:
English
Available
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