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Y W Mai

Y W Mai

8 results found
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1.
Science and Engineering of Short Fibre-Reinforced Polymer Composites16 % POD/NR
Science and Engineering of Short Fibre-Reinforced Polymer Composites
By: Shao-Yun Fu, Bernd Lauke, S-Y Fu, Y -W Mai, Bernd (Leibniz Institute of Polymer Research, Germany) Lauke
Publisher: Woodhead Publishing
No Review Yet
₹21,000
₹17,640
Binding:
Paperback
Release:
27 Aug 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Science and Engineering of Short Fibre Reinforced Polymer Composites49 %
Science and Engineering of Short Fibre Reinforced Polymer Composites
By: Shao-Yun Fu, Yiu-Wing Mai, Bernd Lauke, Y -W Mai
Publisher: Woodhead Publishing
No Review Yet
₹23,355
₹11,911
Binding:
Hardback
Release:
06 Jul 2009
Language:
English
Available
Ships within 4-6 Days Explain..
3.
Physical Properties and Applications of Polymer Nanocomposites43 %
Physical Properties and Applications of Polymer Nanocomposites
By: Sie Chin Tjong, Yu-Wing Mai, S. C. (EDT) Tjong, Y. -W. (EDT) Mai, S. C. Tjong
Publisher: Elsevier Science & Technology
No Review Yet
₹30,743
₹17,524
Binding:
Hardcover
Release:
12 Nov 2010
Language:
English
Available
Ships within 2-4 Days Explain..
4.
Fracture Mechanics of Cementitious Materials2 % POD/NR
Fracture Mechanics of Cementitious Materials
By: Y.W. Mai, Y. W. Mai, B. Cotterell, B Cotterell, Y W Mai
Publisher: Taylor and Francis
No Review Yet
₹6,716
₹6,582
Binding:
Paperback
Release:
12 Dec 2019
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
5.
Physical Properties and Applications of Polymer Nanocomposites18 % POD/NR
Physical Properties and Applications of Polymer Nanocomposites
By: Y. W. Mai, S C Tjong, Y -W Mai, Y.-W. (University Chair and Professor of Mechanical Engineering at the University of Sydney, Australia) Mai, S C (City University of Hong Kong, China) Tjong
Publisher: Woodhead Publishing
No Review Yet
₹31,500
₹25,830
Binding:
Paperback
Release:
19 Aug 2016
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Fracture Mech Cement Materials11 % POD/NR
Fracture Mech Cement Materials
By: Yiv-Wing Mai, Y.W. Mai, Brian Cotterell, Y. W. Mai, B. Cotterell
Publisher: E & FN Spon
No Review Yet
₹26,460
₹23,549
Binding:
Hardback
Release:
28 Dec 1995
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
7.
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture26 % NR
Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
By: E-H Wong, E. H. Wong, S. K. Woon, Y. W. Mai, Y -W Mai
Publisher: Woodhead Publishing
No Review Yet
₹18,900
₹13,986
Binding:
Hardback
Release:
22 May 2015
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
8.
Composite Technologies for 202034 % NR
Composite Technologies for 2020
By: Z. Su, L. Ye, Y. W. Mai, L Ye, Y -W Mai
Publisher: Woodhead Publishing
No Review Yet
₹44,100
₹29,106
Binding:
Hardback
Release:
01 Jun 2004
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
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