Humburger Icon
Logo1
Login & Sign up
Bookswagon-24x7 online bookstore
AddBanner
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Categories
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
3 results found
List viewGrid view
Sort By:
1.
Thin Films -- Stresses and Mechanical Properties X: Volume 79538 % NR
Thin Films -- Stresses and Mechanical Properties X: Volume 795
By: Y-C Joo, S. G. Corcoran, N. R. Moody, Sean G. Corcoran, Young-Chang Joo
Publisher: Cambridge University Press
No Review Yet
₹3,558
₹2,206
Binding:
Hardcover
Release:
22 Mar 2004
Language:
English
Available
Ships within 1-2 Days Explain..
2.
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 61215 % POD/NR
Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics: Volume 612
By: Karen Maex, S. Ogawa, G. S. Oehrlein, K. Maex, Young-Chang Joo
Publisher: Cambridge University Press
No Review Yet
₹2,940
₹2,499
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Thin Films Stresses and Mechanical Properties X: Volume 7952 % NR
Thin Films Stresses and Mechanical Properties X: Volume 795
By: Sean G. Corcoran, Young-Chang Joo, Neville R. Moody
Publisher: Cambridge University Press
No Review Yet
₹2,732
₹2,684
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found