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Yufu Zhang

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Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-informed Design Of Microelectronic Components

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Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-informed Design Of Microelectronic Components

By: Sachin Sapatnekar, Bing Shi, Avram Bar-Cohen, Ankur Srivastava, Yufu Zhang

Publisher: World Scientific Publishing Co Pte Ltd

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₹24,033

Binding:	Hardback
Release:	18 Dec 2014
Language:	English

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