The latest materials, modeling, and analysis to avoid high-temperature failure
Creep of Materials and Structures details the latest knowledge surrounding creep phenomena and material failure at elevated temperatures. Originally published as a special edition of the Journal of Strain Analysis for Engineering Design, this review presents essential information regarding safe design procedures, advances in materials science, material behavior modeling, stress analysis and more. Staying abreast of the latest findings is critical when safety is at stake, and this review offers a single-volume reference for the latest knowledge in the field.
About the Author:
T. H. Hyde is the author of Creep of Materials and Structures, published by Wiley.