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Diffusion and Stresses: (Volume 264 Defect and Diffusion Forum)

Diffusion and Stresses: (Volume 264 Defect and Diffusion Forum)

          
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About the Book

The question of the interrelationship between diffusion and stress is almost as old as the investigation of diffusion itself. Nowadays, the study of various diffusion and solid-state reaction processes in thin films and multilayers is a vital area of research activity in which, inevitably, diffusion-induced or thermal stresses are of primary importance.This timely book covers all aspects of the interrelationship between stresses and diffusion phenomena occurring in bulk solids, thin films and multilayered materials and also those which take place at surfaces and interfaces. Such stress-effects are increasingly important at the nanoscale, and the topics covered are fully related to recent progress made in the field and to the further challenges which are yet to be met.

Table of Contents:
Stress and Intermixing in Epitaxial Ni(111)/Mo(110) Superlattices Redistribution of Implanted Species in Polycrystalline Silicon Films on Silicon Substrate Investigating Interdiffusion in Mo/V Multilayers from X-Ray Scattering and Kinetic Simulations Intermixing in Cu/Co: Molecular Dynamics Simulations and Auger Electron Spectroscopy Depth Profiling Simultaneous Measurement of Tracer Jump Frequencies on Different Sublattices in Ga7Pd3 Using PAC Dopant Diffusion during Amorphous Silicon Crystallization Grain Boundary Surface Tension, Segregation and Diffusion in Cu-Sn System The Stress Field in Cu-Fe-Ni Diffusion Couples Effect of Morphology on the Mobility of Nanosized Liquid Pb Inclusions in Solid Al Nonlinear Field Theory of the Stress Induced Interdiffusion and Mass Transport Stress Evolution in Thin Films; Diffusion and Reactions Cross Diffusion-Stresses Effects Nanoscale Effects in Interdiffusion Diffusion-Induced Stresses: Theory and Applications Nonequilibrium Vacancies in Nanosystems Nonlinear Stress Effects in Diffusion Stress Relaxation Mechanisms during Cd21Ni5 Intermetallic Growth under High Hydrostatic Pressure Thermal and Mechanical Stability of Polycrystalline Nanowires On the Role of Stress, Strain and Diffusion in Dissolution – Condensation Mechanism of Liquid Metal Embrittlement Diffusion of Implanted Metals in Tantalum Silicide Solid-State Reactions in Ni(10 nm)/C(2 nm)/Si(001) Thin Film System Influence of Annealing Environment and Film Thickness on the Phase Formation in the Ti/Si(100) and (Ti +Si)/Si(100) Thin Film Systems Study of Diffusion and Reaction Diffusion in the Fe-C-Nb System On the Local Equilibrium during Dissolution of a Thin Film


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Product Details
  • ISBN-13: 9783908451419
  • Publisher: Trans Tech Publications Ltd
  • Publisher Imprint: Trans Tech Publications Ltd
  • Height: 240 mm
  • No of Pages: 186
  • Spine Width: 9 mm
  • Weight: 400 gr
  • ISBN-10: 3908451418
  • Publisher Date: 29 Apr 2007
  • Binding: Paperback
  • Language: English
  • Series Title: Volume 264 Defect and Diffusion Forum
  • Volume: Volume 264
  • Width: 170 mm


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