A Landmark text thoroughly updated, including a new CD As digital devices continue to be produced at increasingly lower costs and with higher speeds, the need for effective electromagnetic compatibility (EMC) design practices has become more critical than ever to avoid unnecessary costs in bringing products into compliance with governmental regulations. The Second Edition of this landmark text has been thoroughly updated and revised to reflect these major developments that affect both academia and the electronics industry. Readers familiar with the First Edition will find much new material, including: * Latest U.S. and international regulatory requirements * PSpice used throughout the textbook to simulate EMC analysis solutions * Methods of designing for Signal Integrity * Fortran programs for the simulation of Crosstalk supplied on a CD * OrCAD(r) PSpice(r) Release 10.0 and Version 8 Demo Edition software supplied on a CD * The final chapter on System Design for EMC completely rewritten * The chapter on Crosstalk rewritten to simplify the mathematics Detailed, worked-out examples are now included throughout the text. In addition, review exercises are now included following the discussion of each important topic to help readers assess their grasp of the material. Several appendices are new to this edition including Phasor Analysis of Electric Circuits, The Electromagnetic Field Equations and Waves, Computer Codes for Calculating the Per-Unit-Length Parameters and Crosstalk of Multiconductor Transmission Lines, and a SPICE (PSPICE) tutorial. Now thoroughly updated, the Second Edition of Introduction to Electromagnetic Compatibility remains the textbook of choice for university/college EMC courses as well as a reference for EMC design engineers. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

Table of Contents:
Preface xvii 1 Introduction to Electromagnetic Compatibility (EMC) 1 1.1 Aspects of EMC 3 1.2 History of EMC 10 1.3 Examples 12 1.4 Electrical Dimensions and Waves 14 1.5 Decibels and Common EMC Units 23 Problems 43 References 48 2 EMC Requirements for Electronic Systems 49 2.1 Governmental Requirements 50 2.2 Additional Product Requirements 79 2.3 Design Constraints for Products 82 2.4 Advantages of EMC Design 84 Problems 86 References 89 3 Signal Spectra—the Relationship between the Time Domain and the Frequency Domain 91 3.1 Periodic Signals 91 3.3 Spectrum Analyzers 142 3.4 Representation of Nonperiodic Waveforms 148 3.5 Representation of Random (Data) Signals 151 3.6 Use of SPICE (PSPICE) In Fourier Analysis 155 Problems 167 References 175 4 Transmission Lines and Signal Integrity 177 4.1 The Transmission-Line Equations 181 4.2 The Per-Unit-Length Parameters 184 4.3 The Time-Domain Solution 204 4.4 High-Speed Digital Interconnects and Signal Integrity 225 4.5 Sinusoidal Excitation of the Line and the Phasor Solution 260 4.6 Lumped-Circuit Approximate Models 283 Problems 287 References 297 5 Nonideal Behavior of Components 299 5.1 Wires 300 5.2 Printed Circuit Board (PCB) Lands 312 5.3 Effect of Component Leads 315 5.4 Resistors 317 5.5 Capacitors 325 5.6 Inductors 336 5.7 Ferromagnetic Materials—Saturation and Frequency Response 340 5.8 Ferrite Beads 343 5.9 Common-Mode Chokes 346 5.10 Electromechanical Devices 352 5.11 Digital Circuit Devices 357 5.12 Effect of Component Variability 358 5.13 Mechanical Switches 359 Problems 369 References 375 6 Conducted Emissions and Susceptibility 377 6.1 Measurement of Conducted Emissions 378 6.2 Power Supply Filters 385 6.3 Power Supplies 401 6.4 Power Supply and Filter Placement 414 6.5 Conducted Susceptibility 416 Problems 416 References 419 7 Antennas 421 7.1 Elemental Dipole Antennas 421 7.2 The Half-Wave Dipole and Quarter-Wave Monopole Antennas 429 7.3 Antenna Arrays 440 7.4 Characterization of Antennas 448 7.5 The Friis Transmission Equation 466 7.6 Effects of Reflections 470 7.7 Broadband Measurment Antennas 486 Problems 494 References 501 8 Radiated Emissions and Susceptibility 503 8.1 Simple Emission Models for Wires and PCB Lands 504 8.2 Simple Susceptibility Models for Wires and PCB Lands 533 Problems 550 References 556 9 Crosstalk 559 9.1 Three-Conductor Transmission Lines and Crosstalk 560 9.2 The Transmission-Line Equations for Lossless Lines 564 9.3 The Per-Unit-Length Parameters 567 9.4 The Inductive–Capacitive Coupling Approximate Model 595 9.5 Lumped-Circuit Approximate Models 624 9.6 An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines 624 9.7 Shielded Wires 647 9.8 Twisted Wires 677 Problems 701 References 710 10 Shielding 713 10.1 Shielding Effectiveness 718 10.2 Shielding Effectiveness: Far-Field Sources 721 10.3 Shielding Effectiveness: Near-Field Sources 735 10.4 Low-Frequency, Magnetic Field Shielding 742 10.5 Effect of Apertures 745 Problems 750 References 751 11 System Design for EMC 753 11.1 Changing the Way We Think about Electrical Phenomena 758 11.2 What Do We Mean by the Term “Ground”? 768 11.3 Printed Circuit Board (PCB) Design 805 11.4 System Configuration and Design 827 11.5 Diagnostic Tools 847 Problem 856 References 857 Appendix A The Phasor Solution Method 859 A.1 Solving Differential Equations for Their Sinusoidal, Steady-State Solution 859 A.2 Solving Electric Circuits for Their Sinusoidal, Steady-State Response 863 Problems 867 References 869 Appendix B The Electromagnetic Field Equations and Waves 871 B.1 Vector Analysis 872 B.2 Maxwell’s Equations 881 B.2.1 Faraday’s Law 881 B.2.2 Ampere’s Law 892 B.2.3 Gauss’ Laws 898 B.2.4 Conservation of Charge 900 B.2.5 Constitutive Parameters of the Medium 900 B.3 Boundary Conditions 902 B.4 Sinusoidal Steady State 907 B.5 Power Flow 909 B.6 Uniform Plane Waves 909 B.6.1 Lossless Media 912 B.6.2 Lossy Media 918 B.6.3 Power Flow 922 B.6.4 Conductors versus Dielectrics 923 B.6.5 Skin Depth 925 B.7 Static (DC) Electromagnetic Field Relations— a Special Case 927 B.7.1 Maxwell’s Equations for Static (DC) Fields 927 B.7.1.1 Range of Applicability for Low-Frequency Fields 928 B.7.2 Two-Dimensional Fields and Laplace’s Equation 928 Problems 930 References 939 Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines 941 C.1 WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires 942 C.2 RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables 947 C.3 PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards 949 C.4 MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines 951 C.5 STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines 952 C.6 SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line 954 C.7 SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line 956 Appendix D A SPICE (PSPICE) Tutorial 959 D.1 Creating the SPICE or PSPICE Program 960 D.2 Circuit Description 961 D.3 Execution Statements 966 D.4 Output Statements 968 D.5 Examples 970 References 974 Index 975