This book takes a holistic approach to reliability engineering for electrical and electronic systems by looking at the failure mechanisms, testing methods, failure analysis, characterisation techniques and prediction models that can be used to increase reliability for a range of devices. The text describes the reliability behavior of electrical and electronic systems. It takes an empirical scientific approach to reliability engineering to facilitate a greater understanding of operating conditions, failure mechanisms and the need for testing for a more realistic characterisation. After introducing the fundamentals and background to reliability theory, the text moves on to describe the methods of reliability analysis and charactersation across a wide range of applications.

Table of Contents:
List of contributors Woodhead Publishing Series in Electronic and Optical Materials Foreword 1: Introduction Abstract 1.1 Introduction 1.2 The focus of the book 1.3 Reliability science and engineering fundamentals (Chapters 2–4) 1.4 Reliability methods in component and system development (Chapters 5–9) 1.5 Reliability modelling and testing in specific applications (Chapters 10 and 11) 1.6 Conclusion 2: Reliability and stupidity: mistakes in reliability engineering and how to avoid them Abstract 2.1 Introduction 2.2 Common mistakes in reliability engineering 2.3 Conclusion 3: Physics-of-failure (PoF) methodology for electronic reliability Abstract 3.1 Introduction 3.2 Reliability 3.3 PoF models 3.4 PoF reliability assessment 3.5 Applications of PoF to ensure reliability 3.6 Summary and areas of future interest 4: Modern instruments for characterizing degradation in electrical and electronic equipment Abstract 4.1 Introduction 4.2 Destructive techniques 4.3 Nondestructive techniques 4.4 In situ measurement techniques 4.5 Conclusions 5: Reliability building of discrete electronic components Abstract 5.1 Introduction 5.2 Reliability building 5.3 Failure risks and possible corrective actions 5.4 Effect of electrostatic discharge on discrete electronic components 5.5 Conclusions 6: Reliability of optoelectronics Abstract 6.1 Introduction 6.2 Overview of optoelectronics reliability 6.3 Approaches and recent developments 6.4 Case study: reliability of buried heterostructure (BH) InP semiconductor lasers 6.5 Reliability extrapolation and modeling 6.6 Electrostatic discharge (ESD) and electrical overstress (EOS) 6.7 Conclusions 7: Reliability of silicon integrated circuits Abstract Acknowledgments 7.1 Introduction 7.2 Reliability characterization approaches 7.3 Integrated circuit (IC) wear-out failure mechanisms 7.4 Summary and conclusions 8: Reliability of emerging nanodevices Abstract 8.1 Introduction to emerging nanodevices 8.2 Material and architectural evolution of nanodevices 8.3 Failure mechanisms in nanodevices 8.4 Reliability challenges: opportunities and issues 8.5 Summary and conclusions 9: Design considerations for reliable embedded systems Abstract 9.1 Introduction 9.2 Hardware faults 9.3 Reliable design principles 9.4 Low-cost reliable design 9.5 Future research directions 9.6 Conclusions 10: Reliability approaches for automotive electronic systems Abstract Acknowledgment 10.1 Introduction 10.2 Circuit reliability challenges for the automotive industry 10.3 Circuit reliability checking for the automotive industry 10.4 Using advanced electronic design automation (EDA) tools 10.5 Case studies and examples 10.6 Conclusion 11: Reliability modeling and accelerated life testing for solar power generation systems Abstract 11.1 Introduction 11.2 Overview 11.3 Challenges 11.4 Modeling 11.5 Accelerated life testing (ALT) 11.6 ALT example: how to craft a thermal cycling ALT plan for SnAgCu (SAC) solder failure mechanism 11.7 How to craft a temperature, humidity, and bias ALT plan for CMOS metallization corrosion 11.8 Developments and opportunities 11.9 Conclusions 11.10 Sources of further information Index