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Token-Ring Technology Report

Token-Ring Technology Report

          
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About the Book

Please note this is a Short Discount publication. This report provides an overview of the IBM Token-Ring technology and products built by IBM and compatible vendors. It consists of two sections: 1. A summary of the design trade-offs for the IBM Token-Ring. 2. A summary of the products of the major token-ring compatible vendors broken down by adapters and components, wiring systems, testing, and new chip technology.

Table of Contents:
Section I: LAN standards. Overview of token rings. Goals of the IBM token ring. Wiring systems. The need for a common wiring system. Detailed design of certain aspects of the cable plan. Grounding. Signalling. Jitter. Type 3 cable. Use of the cabling system in operational environments. Baluns. Configuration rules. Data grade cable. The move to optical fiber. Multistation access unit [MAU]. The ring adapter. Specialized adapter functions. Reliability functions. Management. Other capabilities of the token ring. Source routing. 4/16 Mbps. Early token release. Conclusion. Section II: Adapter Products and Accessories: IBM token ring. IBM 8209 LAN bridge. Proteon ProNET-4. Racore computer products inc. 3Com. Wiring Systems: STAR-TEK inc. SynOptics token ring support within network utility architectures. Testing: Bytex systems ATS 1000 token ring LAN analysis system. Time domain reflectometry applications for token ring networks. New Chip Technology: Toshiba 16 / 4 mbps token-ring chipset.


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Product Details
  • ISBN-13: 9781856170949
  • Publisher: Elsevier Science & Technology
  • Publisher Imprint: Elsevier Advanced Technology
  • ISBN-10: 1856170942
  • Publisher Date: 31 Oct 1991
  • Binding: Paperback


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