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E. Todd Ryan

E. Todd Ryan

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1.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 99016 % POD/NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- And Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon, E Todd Ryan
Publisher: Cambridge University Press
No Review Yet
₹2,940
₹2,470
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: D. Y. Yoon, Q. Lin, E. T. Ryan, E. Todd Ryan, Wen-Li Wu
Publisher: Cambridge University Press
No Review Yet
₹2,564
Binding:
Hardcover
Release:
12 Sep 2007
Language:
English
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