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Qinghuang Lin

Qinghuang Lin

5 results found
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1.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 9907 % POD/NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Cambridge University Press
No Review Yet
₹3,463
₹3,221
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Advanced Etch Technology for Nanopatterning IVNR
Advanced Etch Technology for Nanopatterning IV
By: Qinghuang Lin
Publisher: Spie Press
No Review Yet
₹8,254
Binding:
Paperback
Release:
30 Jul 2015
Language:
English
Out of Stock
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3.
Advanced etch Technology for Nanopatterning VNR
Advanced etch Technology for Nanopatterning V
By: Qinghuang Lin, Sebastian U. Engelmann
Publisher: Spie Press
No Review Yet
₹7,089
Binding:
Paperback
Release:
30 Jul 2016
Language:
English
Out of Stock
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4.
Polymers for Microelectronics and NanoelectronicsPOD/NR
Polymers for Microelectronics and Nanoelectronics
By: Jeffrey C. Hedrick, Qinghuang Lin, Raymond A. Pearson
Publisher: Oxford University Press Inc
No Review Yet
₹15,956
Binding:
Hardback
Release:
29 Apr 2004
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
5.
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990NR
Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Volume 990
By: E. Todd Ryan, Wen-Li Wu, Qinghuang Lin, Do Yeung Yoon
Publisher: Materials Research Society
No Review Yet
₹2,564
Binding:
Hardback
Release:
12 Sep 2007
Language:
English
Out of Stock
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