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E.J. Rymaszewski

E.J. Rymaszewski

6 results found
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1.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
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2.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
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3.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
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4.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
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₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
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5.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
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₹5,423
₹4,393
Binding:
Hardback
Release:
/03/1998
Language:
English
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6.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
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₹7,099
₹5,750
Binding:
Hardback
Release:
/01/1996
Language:
English
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