Buy books written by R. R. Tummala Available at BooksWagon

1.

25 %

Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition

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₹1,599

₹1,199

Binding:	Paperback
Language:	English

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2.

37 %

Microelectronics Packaging Handbook

By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala

Publisher: Chapman and Hall

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₹22,899

₹14,426

Binding:	Hardback
Release:	31 Jan 1997
Language:	English

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3.

47 %

Sources and Expressions of Resiliency in Trauma Survivors

By: Pratyusha Tummala-Narra, Mary R Harvey

Publisher: Taylor & Francis Inc

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₹6,681

₹3,541

Binding:	Paperback
Release:	15 Mar 2007
Language:	English

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4.

37 %

Electronic Packaging for High Reliability, Low Cost Electronics

By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala

Publisher: Kluwer Academic Publishers

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₹17,174

₹10,820

Binding:	Hardback
Release:	29 Feb 2000
Language:	English

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5.

37 %

Microelectronics Packaging Handbook

By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala

Publisher: Springer-Verlag New York Inc.

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₹22,899

₹14,426

Binding:	Paperback
Release:	23 Oct 2012
Language:	English

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6.

37 %

Microelectronics Packaging Handbook

By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala

Publisher: Chapman and Hall

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₹17,174

₹10,820

Binding:	Hardback
Release:	31 Jan 1997
Language:	English

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7.

Microelectronics Packaging Handbook on CD-ROM

By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala

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₹6,475

Binding:	CD-ROM
Language:	English

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8.

37 %

Electronic Packaging for High Reliability, Low Cost Electronics

By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala

Publisher: Springer

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₹17,174

₹10,820

Binding:	Paperback
Release:	03 Dec 2010
Language:	English

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9.

Sources and Expressions of Resiliency in Trauma Survivors

By: Pratyusha Tummala-Narra, Mary R Harvey

Publisher: Taylor & Francis Ltd

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₹5,707

Binding:	Digital (delivered electronically)
Release:	02 Feb 2026
Language:	English

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10.

Sources and Expressions of Resiliency in Trauma Survivors

By: Pratyusha Tummala-Narra, Mary R Harvey

Publisher: Taylor & Francis Ltd

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₹5,707

Binding:	Digital (delivered electronically)
Release:	02 Feb 2026
Language:	English

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11.

Wirebonding in Microelectronics Packaging

By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein

Publisher: International Thomson Publishing Services

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₹0

Binding:	Hardback
Release:	01 Mar 1998
Language:	English

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12.

Plastic, Thin-Film, and Ceramic Packaging

By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein

Publisher: International Thomson Publishing Services

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₹0

Binding:	Hardback
Release:	01 Mar 1998
Language:	English

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13.

Heat Transfer in Electonic Packages

By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein

Publisher: International Thomson Publishing Services

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₹0

Binding:	Hardback
Release:	01 Mar 1998
Language:	English

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14.

Microelectronics Package Wiring and Electrical Design

By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein

Publisher: International Thomson Publishing Services

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₹0

Binding:	Hardback
Release:	01 Mar 1998
Language:	English

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15.

Fundamentals of Microsystems Packaging

By: Rao R Tummala

Publisher: McGraw-Hill Companies

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₹0

Binding:	Digital (delivered electronically)
Release:	01 Jan 2000

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16.

Microelectronics Packaging Handbook, 3-part set

By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala

Publisher: Chapman and Hall

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₹26,668

Binding:	SA
Release:	31 Jan 1997
Language:	English

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17.

NR

Microelectronics Packaging Handbook

By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski

Publisher: Springer Nature B.V.

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₹4,323

Binding:	Paperback
Release:	14 May 2012
Language:	English

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18.

19 % NR

Microelectronics Packaging Fundamentals

By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein

Publisher: Chapman and Hall

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₹5,423

₹4,393

Binding:	Hardback
Release:	/03/1998
Language:	English

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19.

19 % NR

Microelectronics Packaging Handbook

By: R. R. Tummala, E.J. Rymaszewski, I. Turlik

Publisher: Kluwer Academic Publishers Group

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₹7,099

₹5,750

Binding:	Hardback
Release:	/01/1996
Language:	English

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20.

35 % NR

Sources and Expressions of Resiliency in Trauma Survivors

By: Pratyusha Tummala-Narra, Mary R Harvey

Publisher: Taylor & Francis Inc

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₹19,763

₹12,846

Binding:	Hardback
Release:	27 Mar 2007
Language:	English

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