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R. R. Tummala

R. R. Tummala

17 results found
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1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Sources and Expressions of Resiliency in Trauma Survivors48 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Inc
No Review Yet
₹6,551
₹3,407
Binding:
Paperback
Release:
15 Mar 2007
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Kluwer Academic Publishers
No Review Yet
₹16,274
₹10,253
Binding:
Hardback
Release:
29 Feb 2000
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition26 %
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
No Review Yet
₹1,599
₹1,183
Binding:
Paperback
Language:
English
Available
Ships within 2-4 Days Explain..
5.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹21,699
₹13,670
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹3,945
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 8-10 Days Explain..
7.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹16,274
₹10,253
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
8.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Springer
No Review Yet
₹16,274
₹10,253
Binding:
Paperback
Release:
03 Dec 2010
Language:
English
Available
Ships within 14-16 Days Explain..
9.
Sources and Expressions of Resiliency in Trauma Survivors
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Ltd
No Review Yet
₹5,707
Binding:
Digital (delivered electronically)
Release:
02 Feb 2026
Language:
English
Out of Stock
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10.
Sources and Expressions of Resiliency in Trauma Survivors
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Ltd
No Review Yet
₹5,707
Binding:
Digital (delivered electronically)
Release:
02 Feb 2026
Language:
English
Out of Stock
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11.
Sources and Expressions of Resiliency in Trauma Survivors35 %
Sources and Expressions of Resiliency in Trauma Survivors
By: Pratyusha Tummala-Narra, Mary R Harvey
Publisher: Taylor & Francis Inc
No Review Yet
₹19,375
₹12,594
Binding:
Hardback
Release:
27 Mar 2007
Language:
English
Out of Stock
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12.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹26,668
Binding:
SA
Release:
31 Jan 1997
Language:
English
Out of Stock
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13.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,323
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
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14.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
/03/1998
Language:
English
Out of Stock
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15.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,099
₹5,750
Binding:
Hardback
Release:
/01/1996
Language:
English
Out of Stock
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16.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
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17.
Microelectronics Packaging Handbook13 % POD/NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹23,749
₹20,775
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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