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R.R. Tummala

R.R. Tummala

15 results found
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1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹22,899
₹14,426
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Kluwer Academic Publishers
No Review Yet
₹17,174
₹10,820
Binding:
Hardback
Release:
29 Feb 2000
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹22,899
₹14,426
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
No Review Yet
₹6,475
Binding:
CD-ROM
Language:
English
Available
Ships within 1-2 Days Explain..
5.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹17,174
₹10,820
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Electronic Packaging for High Reliability, Low Cost Electronics37 %
Electronic Packaging for High Reliability, Low Cost Electronics
By: Marija Kosec, Darko Belavic, W.K. Jones, R.R. Tummala
Publisher: Springer
No Review Yet
₹17,174
₹10,820
Binding:
Paperback
Release:
03 Dec 2010
Language:
English
Available
Ships within 14-16 Days Explain..
7.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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8.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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9.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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10.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
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11.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹26,668
Binding:
SA
Release:
31 Jan 1997
Language:
English
Out of Stock
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12.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,323
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
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13.
Microelectronics Packaging Fundamentals19 % NR
Microelectronics Packaging Fundamentals
By: R. R. Tummala, E.J. Rymaszewski, A.G. Klopfenstein
Publisher: Chapman and Hall
No Review Yet
₹5,423
₹4,393
Binding:
Hardback
Release:
/03/1998
Language:
English
Out of Stock
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14.
Microelectronics Packaging Handbook19 % NR
Microelectronics Packaging Handbook
By: R. R. Tummala, E.J. Rymaszewski, I. Turlik
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,099
₹5,750
Binding:
Hardback
Release:
/01/1996
Language:
English
Out of Stock
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15.
Microelectronics Packaging Handbook13 % POD/NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹23,749
₹20,775
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Out of Stock
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
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