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Klopfenstein Alan G. Klopfenstein

Klopfenstein Alan G. Klopfenstein

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1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹21,231
₹13,376
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹3,475
Binding:
CD-ROM
Release:
31 Mar 1998
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹21,231
₹13,376
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹15,923
₹10,031
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Microelectronics Packaging Handbook10 % POD/NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹37,155
₹33,440
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
International Edition
Ships within 12-14 Days Explain..
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Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
6.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Van Nostrand Reinhold Inc.,U.S.
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
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7.
Microelectronics Packaging Handbook, 3-part setNR
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹42,926
Binding:
Book
Release:
31 Jan 1997
Language:
English
Out of Stock
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8.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,299
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
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