Humburger Icon
Let's Explore, Bibiliophile
  • Account Icon
  • Wishlist Icon
  • Cart Icon

    Cart Overview

    Show All
    Your cart is empty
Logo1
close menu
Bookswagon-24x7 online bookstore
close menu
My Account
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Menu
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
Alan G Klopfenstein

Alan G Klopfenstein

13 results found
List viewGrid view
Sort By:
1.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹22,899
₹14,426
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹22,899
₹14,426
Binding:
Paperback
Release:
23 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Microelectronics Packaging Handbook37 %
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹17,174
₹10,820
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Microelectronics Packaging Handbook on CD-ROM
Microelectronics Packaging Handbook on CD-ROM
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
No Review Yet
₹6,475
Binding:
CD-ROM
Language:
English
Available
Ships within 1-2 Days Explain..
5.
Microelectronics Packaging Handbook, 3-part set
Microelectronics Packaging Handbook, 3-part set
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹26,668
Binding:
SA
Release:
31 Jan 1997
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
6.
Second-Level Microelectronics Packaging
Second-Level Microelectronics Packaging
By: Rao Tummala, Eugene J Rymaszewski, Alan G Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
7.
Wirebonding in Microelectronics Packaging
Wirebonding in Microelectronics Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
8.
Plastic, Thin-Film, and Ceramic Packaging
Plastic, Thin-Film, and Ceramic Packaging
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
9.
Heat Transfer in Electonic Packages
Heat Transfer in Electonic Packages
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
10.
Microelectronics Package Wiring and Electrical Design
Microelectronics Package Wiring and Electrical Design
By: R. R. Tummala, E.J. Rymaszewski, Alan G. Klopfenstein, Eugene J. Rymaszewski, A.G. Klopfenstein
Publisher: International Thomson Publishing Services
No Review Yet
₹0
Binding:
Hardback
Release:
01 Mar 1998
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
11.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
12.
Microelectronics Packaging Handbook13 % POD/NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Eugene J. Rymaszewski, R.R. Tummala
Publisher: Chapman and Hall
No Review Yet
₹23,749
₹20,775
Binding:
Hardback
Release:
31 Jan 1997
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
13.
Microelectronics Packaging HandbookNR
Microelectronics Packaging Handbook
By: Tummala R.R. Tummala, Klopfenstein Alan G. Klopfenstein, Rymaszewski Eugene J. Rymaszewski
Publisher: Springer Nature B.V.
No Review Yet
₹4,323
Binding:
Paperback
Release:
14 May 2012
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
No more records found
ASK VIDYA