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Rao Tummala

Rao Tummala Rao Tummala is a Chair professor and Director of the Microsystems Packaging Center at the Georgia Institute of Technology. The author of Microelectronics Packaging Handbook, Volumes I, II, and III, the best-selling reference that defines the enire field, he is an electronics and materials engineer and an experienced designer of microelectronics. He was a longtime packaging technologist and IBM Fellow at IBM. Read More Read Less

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1.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second EditionNR
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
By: Rao Tummala
Publisher: McGraw-Hill Education
No Review Yet
₹21,849
Binding:
Hardback
Release:
18 Aug 2019
Language:
English
International Edition
Ships within 12-14 Days Explain..
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2.
System on PackagePOD/NR
System on Package
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹14,950
Binding:
Hardback
Release:
16 Jun 2008
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications | Second Edition
By: Tummala, Rao R.
No Review Yet
₹861
Binding:
Paperback
Language:
English
Out of Stock
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4.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Education
No Review Yet
₹13,864
Binding:
Digital (delivered electronically)
Release:
29 May 2001
Language:
English
Out of Stock
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5.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹11,565
Binding:
Digital (delivered electronically)
Release:
29 May 2001
Language:
English
Out of Stock
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6.
Fundamentals of Microsystems Packaging
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Professional Publishing
No Review Yet
₹13,353
Binding:
Digital (delivered electronically)
Release:
08 May 2001
Language:
English
Out of Stock
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7.
System on Package
System on Package
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹10,800
Binding:
Digital (delivered electronically)
Release:
22 Jul 2007
Language:
English
Out of Stock
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8.
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
Fundamentals of Device and Systems Packaging: Technologies and Applications, Second Edition
By: Rao Tummala
Publisher: McGraw Hill Education India
No Review Yet
₹17,312
Binding:
Digital (delivered electronically)
Release:
20 Nov 2019
Language:
English
Out of Stock
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9.
Redistribution of Blood Flow Following a Branch Retinal Artery Occlusion
Redistribution of Blood Flow Following a Branch Retinal Artery Occlusion
By: Shanti Rao Tummala
Publisher: Proquest, Umi Dissertation Publishing
No Review Yet
₹6,347
Binding:
Paperback
Release:
01 Sep 2011
Language:
English
Out of Stock
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10.
Fundamentals of Microsystems Packaging10 % NR
Fundamentals of Microsystems Packaging
By: Rao Tummala
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹11,969
₹10,798
Binding:
Hardback
Release:
16 Jun 2001
Language:
English
Out of Stock
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11.
Microelectronics Packaging Handbook9 % NR
Microelectronics Packaging Handbook
By: Alan G. Klopfenstein, Rao R. Tummala, Eugene J. Pymaszewski
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹6,840
₹6,228
Binding:
Hardback
Release:
15 Sep 1996
Language:
English
Out of Stock
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