Humburger Icon
Logo1
close menu
Bookswagon-24x7 online bookstore
close menu
My Account
Home icon Home
Account Icon Account
Wishlist Icon Wishlist
Cart Icon Cart
Bookswagon icon Menu
Close

Refine your Search

By Price

Availability

Shipping Time

Source

Binding

Language

Publication Year

Filter By Category
John H Lau

John H LauJohn H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the Univerity of Hong Kong. Read More Read Less

35 results found
List viewGrid view
Sort By:
1.
Semiconductor Advanced Packaging43 %
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,044
₹6,865
Binding:
Paperback
Release:
19 May 2022
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Chiplet Design and Heterogeneous Integration Packaging43 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹14,234
₹8,113
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology43 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹18,614
₹10,610
Binding:
Hardback
Release:
24 May 2024
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Chiplet Design and Heterogeneous Integration Packaging43 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹19,709
₹11,234
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,592
₹7,933
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Semiconductor Advanced Packaging43 %
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,519
₹9,986
Binding:
Hardback
Release:
18 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,519
₹11,037
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 14-16 Days Explain..
8.
Handbook Of Tape Automated Bonding37 %
Handbook Of Tape Automated Bonding
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,899
₹13,796
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
Ships within 14-16 Days Explain..
9.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,899
₹13,796
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 14-16 Days Explain..
10.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,519
₹11,037
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 14-16 Days Explain..
11.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,044
₹7,588
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 14-16 Days Explain..
12.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹21,899
₹13,796
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 14-16 Days Explain..
13.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,424
₹10,347
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
Ships within 14-16 Days Explain..
14.
Chip On Board37 %
Chip On Board
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,899
₹13,796
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
Ships within 14-16 Days Explain..
15.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: Darrel R. Frear, John H. Lau, Harold S. Morgan, Steven N. Burchett
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,899
₹13,796
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 14-16 Days Explain..
16.
Chiplet Design and Heterogeneous Integration PackagingNR
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
₹4,919
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
17.
CHIP SCALE PACKAGE, CSP19 % NR
CHIP SCALE PACKAGE, CSP
By: John H. Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹5,599
₹4,535
Binding:
Hardback
Release:
28 Feb 1999
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
18.
Building Leadership Bridges Book Set (2015-2019)39 %
Building Leadership Bridges Book Set (2015-2019)
By: Matthew Sowcik, Jean Lau Chin, Seana Lowe Steffen, H. Eric Schockman, John Eric Baugher
Publisher: Emerald Publishing Limited
No Review Yet
₹29,523
₹18,009
Binding:
SA
Release:
10 Aug 2020
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
19.
Chip Scale Package, CSP
Chip Scale Package, CSP
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Professional Publishing
No Review Yet
₹7,693
Binding:
Digital (delivered electronically)
Release:
28 Feb 1999
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
20.
Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,729
Binding:
Hardback
Release:
/08/1993
Language:
English
Out of Stock
Notify me when this book is in stockNotify Me
loadingLoading more results
ASK VIDYA