John H LauJohn H. Lau is President of Express Packaging Systems of Palo Alto, California, the author of 8 books on electronic packaging, and an internationally recognized expert in the field. A former senior engineer at Hewlett-Packard Company, he has more tha 25 years of research and development experience in applying the principles of engineering and science to the electronic, petroleum, nuclear, and defense industries. He has authored and co-authored over 100 technical publications in these areas and is the author and editor of the books Solder Joint Reliability: Theory and Applications; Handbook of Tape Automated Bonding; Thermal Stress and Strain in Microelectronics Packaging; Handbook of Fine Pitch Surface Mount Technology; The Mechanics of Solder Alloys Interconnects; Chip On Board Technologies for Multichip Modules; and Ball Grid Array Technology. Read More Read Less