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John H Lau

John H LauJohn H. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. He is the author of nine previous technical books and teaches throughout the world. Ricky S. Lee (Hong Kong, China) is a Professor of Electrical Engineering at the Univerity of Hong Kong. Read More Read Less

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1.
Semiconductor Advanced Packaging11 % NR
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹13,749
₹12,237
Binding:
Paperback
Release:
19 May 2022
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Semiconductor Advanced Packaging11 % POD/NR
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,839
₹15,877
Binding:
Hardback
Release:
18 May 2021
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,274
₹10,253
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,359
₹10,936
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
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6.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,477
₹7,861
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,359
₹10,936
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 14-16 Days Explain..
8.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹11,934
₹7,518
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 14-16 Days Explain..
9.
Handbook Of Tape Automated Bonding37 %
Handbook Of Tape Automated Bonding
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
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10.
Chip On Board37 %
Chip On Board
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
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11.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹21,699
₹13,670
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 14-16 Days Explain..
12.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: Darrel R. Frear, John H. Lau, Harold S. Morgan, Steven N. Burchett
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 14-16 Days Explain..
13.
Chiplet Design and Heterogeneous Integration PackagingNR
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
₹4,999
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
14.
Chiplet Design and Heterogeneous Integration Packaging43 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹14,234
₹8,113
Binding:
Paperback
Release:
29 Mar 2024
Language:
English
Out of Stock
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15.
Chiplet Design and Heterogeneous Integration Packaging42 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹19,709
₹11,431
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Out of Stock
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16.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology43 %
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,099
₹9,176
Binding:
Hardback
Release:
24 May 2024
Language:
English
Out of Stock
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17.
Building Leadership Bridges Book Set (2015-2019)39 %
Building Leadership Bridges Book Set (2015-2019)
By: Matthew Sowcik, Jean Lau Chin, Seana Lowe Steffen, H. Eric Schockman, John Eric Baugher
Publisher: Emerald Publishing Limited
No Review Yet
₹30,249
₹18,452
Binding:
SA
Release:
10 Aug 2020
Language:
English
Out of Stock
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18.
Chip Scale Package, CSP
Chip Scale Package, CSP
By: John H Lau, Ricky S W Lee
Publisher: McGraw-Hill Professional Publishing
No Review Yet
₹7,693
Binding:
Digital (delivered electronically)
Release:
28 Feb 1999
Language:
English
Out of Stock
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19.
Thermal Stress and Strain in Microelectronics Packaging
Thermal Stress and Strain in Microelectronics Packaging
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹7,729
Binding:
Hardback
Release:
/08/1993
Language:
English
Out of Stock
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20.
3D IC Integration and Packaging
3D IC Integration and Packaging
By: John H Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹16,775
Binding:
Digital (delivered electronically)
Release:
06 Jul 2015
Language:
English
Out of Stock
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