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John H. Lau

John H. Lau

23 results found
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1.
Chiplet Design and Heterogeneous Integration Packaging37 %
Chiplet Design and Heterogeneous Integration Packaging
By: John H. Lau, John H Lau
Publisher: Springer Nature Singapore
No Review Yet
₹15,946
₹10,046
Binding:
Hardback
Release:
28 Mar 2023
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹10,318
₹6,500
Binding:
Paperback
Release:
19 May 2022
Language:
English
Available
Ships within 12-14 Days Explain..
3.
Semiconductor Advanced Packaging37 %
Semiconductor Advanced Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹15,008
₹9,455
Binding:
Hardback
Release:
02 Aug 2021
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹10,787
₹6,796
Binding:
Paperback
Release:
13 Jun 2021
Language:
English
Available
Ships within 12-14 Days Explain..
5.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee, John H Lau
Publisher: Springer
No Review Yet
₹15,008
₹9,455
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 12-14 Days Explain..
6.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹14,070
₹8,864
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 12-14 Days Explain..
7.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹9,380
₹5,909
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 12-14 Days Explain..
8.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹13,132
₹8,273
Binding:
Hardback
Release:
10 May 2018
Language:
English
Available
Ships within 12-14 Days Explain..
9.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹18,760
₹11,819
Binding:
Paperback
Release:
23 Feb 2014
Language:
English
Available
Ships within 12-14 Days Explain..
10.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau, John H Lau
Publisher: Springer
No Review Yet
₹18,760
₹11,819
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 12-14 Days Explain..
11.
Advanced MEMS Packaging22 %
Advanced MEMS Packaging
By: John H. Lau, Cheng Kuo Lee, C.S. Premachandran, John Lau, Cheng Lee
Publisher: McGraw-Hill Education
No Review Yet
₹15,484
₹12,078
Binding:
Hardback
Release:
01 Nov 2009
Language:
English
Available
Ships within 4-6 Days Explain..
12.
Handbook of Tape Automated Bonding37 %
Handbook of Tape Automated Bonding
By: John H Lau
Publisher: Springer
No Review Yet
₹18,760
₹11,819
Binding:
Hardback
Release:
31 Jan 1992
Language:
English
Available
Ships within 12-14 Days Explain..
13.
Mechanics of Solder Alloy Interconnects37 %
Mechanics of Solder Alloy Interconnects
By: John H Lau, Darrel R Frear, Harold S Morgan, Steven N Burchett
Publisher: Springer
No Review Yet
₹18,760
₹11,819
Binding:
Hardback
Release:
31 Jan 1994
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Chip on Board48 %
Chip on Board
By: John H Lau
Publisher: Springer
No Review Yet
₹19,542
₹10,162
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
Ships within 1-2 Days Explain..
15.
Through-Silicon Vias for 3D Integration43 %
Through-Silicon Vias for 3D Integration
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹14,013
₹7,987
Binding:
Hardback
Release:
11 Oct 2012
Language:
English
Available
Ships within 1-2 Days Explain..
16.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects43 %
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹12,629
₹7,199
Binding:
Hardback
Release:
22 Dec 2010
Language:
English
Available
Ships within 1-2 Days Explain..
17.
Chiplet Design and Heterogeneous Integration Packaging1 % NR
Chiplet Design and Heterogeneous Integration Packaging
By: Lau John H. Lau
Publisher: Springer Nature B.V.
No Review Yet
₹4,239
₹4,197
Binding:
Paperback
Release:
28 Mar 2023
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
18.
Building Leadership Bridges Book Set (2015-2019)NR
Building Leadership Bridges Book Set (2015-2019)
By: Matthew Sowcik, Jean Lau Chin, Seana Lowe Steffen, H. Eric Schockman, John Eric Baugher
Publisher: Emerald Publishing Limited
No Review Yet
₹29,215
Binding:
SA
Release:
10 Aug 2020
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
19.
3D IC Integration and PackagingPOD/NR
3D IC Integration and Packaging
By: John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹19,168
Binding:
Hardback
Release:
27 Aug 2015
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
20.
Electronics Manufacturing22 %
Electronics Manufacturing
By: Ricky Lee, C.P. Wong, Ning-Cheng Lee, John Lau, John H Lau
Publisher: McGraw-Hill Education
No Review Yet
₹12,523
₹9,768
Binding:
Hardback
Release:
13 Sep 2002
Language:
English
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