John Lau

John Lau

John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, ITRI Fellow, spent 30 years in the electronics industry (HP and Agilent) in Palo Alto, California, and currently serves as a fellow at the Electronics & Optoelectronics Laboratories, Indutrial Technology Research Institute (ITRI), Taiwan. He has published 16 books with McGraw-Hill, including Reliability of RoHS-Compliant 2D and 3D IC Interconnects, Advanced MEMS Packaging, Electronics Manufacturing with Lead-Free Solders and Low Cost Flip Chip Technologies. Read More Read Less

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1.
Basics Fashion Design 09: Designing Accessories31 %
5.0 (4)
₹1,299
₹896
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03 Oct 2019
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2.
Classical Chinese Literature: An Anthology of Translations20 % NR
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27 Mar 2002
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3.
Phoenix Omnibus Vol. 236 % NR
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₹12,600
₹8,064
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19 Sep 2023
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4.
Chiplet Design and Heterogeneous Integration Packaging37 %
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₹10,046
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28 Mar 2023
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5.
Semiconductor Advanced Packaging37 %
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₹6,500
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19 May 2022
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Semiconductor Advanced Packaging37 %
Publisher: Springer
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₹15,008
₹9,455
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02 Aug 2021
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7.
Assembly and Reliability of Lead-Free Solder Joints37 %
Publisher: Springer
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₹6,796
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13 Jun 2021
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8.
Assembly and Reliability of Lead-Free Solder Joints37 %
Publisher: Springer
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₹15,008
₹9,455
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30 May 2020
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9.
Heterogeneous Integrations37 %
Publisher: Springer
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₹14,070
₹8,864
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12 Apr 2019
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10.
Fan-Out Wafer-Level Packaging37 %
Publisher: Springer
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₹9,380
₹5,909
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16 Dec 2018
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11.
Fan-Out Wafer-Level Packaging37 %
Publisher: Springer
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₹13,132
₹8,273
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10 May 2018
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12.
Through-Silicon Vias for 3D Integration43 %
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11 Oct 2012
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13.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects43 %
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₹7,199
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22 Dec 2010
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14.
Thermal Stress and Strain in Microelectronics Packaging37 %
Publisher: Springer
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₹14,070
₹8,864
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30 Apr 2012
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15.
Solder Joint Reliability37 %
Publisher: Springer
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₹18,760
₹11,819
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23 Feb 2014
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16.
Solder Joint Reliability37 %
Publisher: Springer
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₹18,760
₹11,819
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Release:
31 May 1991
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English
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17.
Advanced MEMS Packaging22 %
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₹15,484
₹12,078
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Release:
01 Nov 2009
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English
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18.
Handbook of Tape Automated Bonding37 %
Publisher: Springer
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₹18,760
₹11,819
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Release:
31 Jan 1992
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19.
Mechanics of Solder Alloy Interconnects37 %
Publisher: Springer
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₹18,760
₹11,819
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Release:
31 Jan 1994
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20.
Chip on Board48 %
Publisher: Springer
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₹19,542
₹10,162
Binding:
Hardback
Release:
30 Jun 1994
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English
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