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John Lau

John LauJohn Lau is Associate Dean for the School of Design and Technology at London College of Fashion, UK. Designing Accessories (Bloomsbury Academic, 2012) was his first book.

101 results found
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1.
Semiconductor Advanced Packaging11 % NR
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹13,749
₹12,237
Binding:
Paperback
Release:
19 May 2022
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
2.
Semiconductor Advanced Packaging11 % POD/NR
Semiconductor Advanced Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,839
₹15,877
Binding:
Hardback
Release:
18 May 2021
Language:
English
International Edition
Ships within 10-12 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
3.
Solder Joint Reliability37 %
Solder Joint Reliability
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
31 May 1991
Language:
English
Available
Ships within 14-16 Days Explain..
4.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹16,274
₹10,253
Binding:
Hardback
Release:
13 Apr 2018
Language:
English
Available
Ships within 14-16 Days Explain..
5.
Heterogeneous Integrations37 %
Heterogeneous Integrations
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,359
₹10,936
Binding:
Hardback
Release:
12 Apr 2019
Language:
English
Available
Ships within 14-16 Days Explain..
6.
Mindfulness for Child and Adolescent Well-Being28 %
Mindfulness for Child and Adolescent Well-Being
By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau
Publisher: Taylor & Francis Ltd
No Review Yet
₹5,624
₹4,049
Binding:
Paperback
Release:
27 Jun 2025
Language:
English
Available
Ships within 14-16 Days Explain..
7.
Basics Fashion Design 09: Designing Accessories28 %
Basics Fashion Design 09: Designing Accessories
By: John Lau
Publisher: Bloomsbury Publishing PLC
5.0 (1)
₹1,299
₹935
Binding:
Paperback
Release:
20 Jan 2019
Language:
English
Available
Ships within 2-4 Days Explain..
8.
Classical Chinese Literature: An Anthology of Translations21 % NR
Classical Chinese Literature: An Anthology of Translations
By: Joseph S. M. Lau, John Minford
Publisher: Columbia University Press
No Review Yet
₹6,250
₹4,938
Binding:
Paperback
Release:
27 Mar 2002
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
9.
Mindfulness for Child and Adolescent Well-Being31 %
Mindfulness for Child and Adolescent Well-Being
By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau
Publisher: Taylor & Francis Ltd
No Review Yet
₹19,375
₹13,369
Binding:
Hardback
Release:
29 Feb 2024
Language:
English
Available
Ships within 14-16 Days Explain..
10.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹12,477
₹7,861
Binding:
Paperback
Release:
30 May 2021
Language:
English
Available
Ships within 14-16 Days Explain..
11.
Representing Agency in Popular Culture44 %
Representing Agency in Popular Culture
By: Mary L. Fahrenbruck, Sin Wen Lau, David Buckingham, John Kerr, Michael G. Cornelius
Publisher: Bloomsbury Publishing PLC
No Review Yet
₹4,874
₹2,729
Binding:
Paperback
Release:
12 Apr 2021
Language:
English
Available
Ships within 18-20 Days Explain..
12.
Assembly and Reliability of Lead-Free Solder Joints37 %
Assembly and Reliability of Lead-Free Solder Joints
By: John H. Lau, Ning-Cheng Lee
Publisher: Springer Verlag, Singapore
No Review Yet
₹17,359
₹10,936
Binding:
Hardback
Release:
30 May 2020
Language:
English
Available
Ships within 14-16 Days Explain..
13.
Media Culture in Transnational Asia28 %
Media Culture in Transnational Asia
By: Hiroki Yamamoto, John Gagnon, Dorothy Wai Sim Lau, Alireza Dehghan, Darlene Machell Espena
Publisher: Rutgers University Press
No Review Yet
₹3,499
₹2,519
Binding:
Paperback
Release:
17 Sep 2020
Language:
English
Available
Ships within 12-14 Days Explain..
14.
Media Culture in Transnational Asia30 %
Media Culture in Transnational Asia
By: Hiroki Yamamoto, John Gagnon, Dorothy Wai Sim Lau, Alireza Dehghan, Darlene Machell Espena
Publisher: Rutgers University Press
No Review Yet
₹15,000
₹10,500
Binding:
Hardback
Release:
17 Sep 2020
Language:
English
Available
Ships within 12-14 Days Explain..
15.
Advanced MEMS Packaging59 %
Advanced MEMS Packaging
By: John Lau, Cheng Lee, C. Premachandran, Yu Aibin
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹16,558
₹6,789
Binding:
Hardback
Release:
16 Dec 2009
Language:
English
Available
Ships within 2-4 Days Explain..
16.
Thermal Stress and Strain in Microelectronics Packaging37 %
Thermal Stress and Strain in Microelectronics Packaging
By: John Lau
Publisher: Springer-Verlag New York Inc.
No Review Yet
₹16,274
₹10,253
Binding:
Paperback
Release:
30 Apr 2012
Language:
English
Available
Ships within 14-16 Days Explain..
17.
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
Reliability of RoHS-Compliant 2D and 3D IC Interconnects
By: John Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹6,207
Binding:
Hardback
Release:
16 Dec 2010
Language:
English
Available
Ships within 8-10 Days Explain..
18.
Through-Silicon Vias for 3D Integration
Through-Silicon Vias for 3D Integration
By: John Lau
Publisher: McGraw-Hill Education - Europe
No Review Yet
₹6,885
Binding:
Hardback
Release:
16 Dec 2012
Language:
English
Available
Ships within 8-10 Days Explain..
19.
Fan-Out Wafer-Level Packaging37 %
Fan-Out Wafer-Level Packaging
By: John H. Lau
Publisher: Springer Verlag, Singapore
No Review Yet
₹11,934
₹7,518
Binding:
Paperback
Release:
16 Dec 2018
Language:
English
Available
Ships within 14-16 Days Explain..
20.
Chip On Board37 %
Chip On Board
By: John H. Lau
Publisher: Kluwer Academic Publishers Group
No Review Yet
₹21,699
₹13,670
Binding:
Hardback
Release:
30 Jun 1994
Language:
English
Available
Ships within 14-16 Days Explain..
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