Buy books written by John Lau Available at BooksWagon

John LauJohn Lau is Associate Dean for the School of Design and Technology at London College of Fashion, UK. Designing Accessories (Bloomsbury Academic, 2012) was his first book.

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26 % NR

Basics Fashion Design 09: Designing Accessories

By: John Lau

Publisher: Bloomsbury Publishing PLC

5.0

(1)

₹3,550

₹2,627

Binding:	Paperback
Release:	20 Jan 2019
Language:	English

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37 %

Semiconductor Advanced Packaging

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹13,679

₹8,618

Binding:	Paperback
Release:	19 May 2022
Language:	English

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37 %

Semiconductor Advanced Packaging

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹18,239

₹11,491

Binding:	Hardback
Release:	18 May 2021
Language:	English

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37 %

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

By: John Lau, Xuejun Fan

Publisher: Springer Nature Switzerland AG

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₹20,519

₹12,927

Binding:	Hardback
Release:	19 May 2025
Language:	English

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37 %

Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹14,819

₹9,336

Binding:	Paperback
Release:	29 Mar 2024
Language:	English

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37 %

Solder Joint Reliability

By: John H. Lau

Publisher: Kluwer Academic Publishers Group

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₹22,799

₹14,363

Binding:	Hardback
Release:	31 May 1991
Language:	English

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37 %

Chiplet Design and Heterogeneous Integration Packaging

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹20,519

₹12,927

Binding:	Hardback
Release:	28 Mar 2023
Language:	English

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37 %

Fan-Out Wafer-Level Packaging

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹17,099

₹10,772

Binding:	Hardback
Release:	13 Apr 2018
Language:	English

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37 %

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹19,379

₹12,209

Binding:	Hardback
Release:	24 May 2024
Language:	English

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10.

37 %

Heterogeneous Integrations

By: John H. Lau

Publisher: Springer Verlag, Singapore

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₹18,239

₹11,491

Binding:	Hardback
Release:	04 Dec 2019
Language:	English

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11.

39 %

Mindfulness for Child and Adolescent Well-Being

By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau

Publisher: Taylor & Francis Ltd

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₹6,227

₹3,798

Binding:	Paperback
Release:	27 Jun 2025
Language:	English

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12.

30 %

Classical Chinese Literature: An Anthology of Translations

By: Joseph S. M. Lau, John Minford

Publisher: Columbia University Press

4.8

(6)

₹4,900

₹3,430

Binding:	Paperback
Release:	27 Mar 2002
Language:	English

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13.

39 %

Mindfulness for Child and Adolescent Well-Being

By: John Chi-Kin Lee, Kevin Ka Shing Chan, Elsa Ngar Sze Lau

Publisher: Taylor & Francis Ltd

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₹22,789

₹13,901

Binding:	Hardback
Release:	29 Feb 2024
Language:	English

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14.

37 %

Assembly and Reliability of Lead-Free Solder Joints

By: John H. Lau, Ning-Cheng Lee

Publisher: Springer Verlag, Singapore

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₹13,109

₹8,259

Binding:	Paperback
Release:	30 May 2021
Language:	English

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15.

37 %

Assembly and Reliability of Lead-Free Solder Joints

By: John H. Lau, Ning-Cheng Lee

Publisher: Springer Verlag, Singapore

No Review Yet

₹18,239

₹11,491

Binding:	Hardback
Release:	30 May 2020
Language:	English

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16.

37 %

Thermal Stress and Strain in Microelectronics Packaging

By: John Lau

Publisher: Springer-Verlag New York Inc.

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₹17,099

₹10,772

Binding:	Paperback
Release:	30 Apr 2012
Language:	English

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17.

Through-Silicon Vias for 3D Integration

By: John Lau

Publisher: McGraw-Hill Education - Europe

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₹7,492

Binding:	Hardback
Release:	16 Dec 2012
Language:	English

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18.

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

By: John Lau

Publisher: McGraw-Hill Education - Europe

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₹6,754

Binding:	Hardback
Release:	16 Dec 2010
Language:	English

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19.

53 %

Advanced MEMS Packaging

By: John Lau, Cheng Lee, C. Premachandran, Yu Aibin

Publisher: McGraw-Hill Education - Europe

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₹17,542

₹8,245

Binding:	Hardback
Release:	16 Dec 2009
Language:	English

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20.

37 %

Handbook Of Tape Automated Bonding

By: John H. Lau

Publisher: Kluwer Academic Publishers Group

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₹22,799

₹14,363

Binding:	Hardback
Release:	31 Jan 1992
Language:	English

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