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Paul S. (University of Texas, Austin) Ho

Paul S. (University of Texas, Austin) Ho

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1.
Materials Reliability in Microelectronics III: Volume 30937 %
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
No Review Yet
₹2,768
₹1,744
Binding:
Hardback
Release:
31 Aug 1993
Language:
English
Available
Ships within 1-2 Days Explain..
2.
Electromigration in Metals10 % NR
Electromigration in Metals
By: Valeriy Sukharev, Martin Gall, Paul S. (University of Texas, Austin) Ho, Paul S Ho, Chao-Kun Hu
Publisher: Cambridge University Press
No Review Yet
₹8,400
₹7,560
Binding:
Hardback
Release:
12 May 2022
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Materials Reliability in Microelectronics III: Volume 30915 % POD/NR
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
No Review Yet
₹2,940
₹2,499
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
4.
Electronic Packaging Materials Science IX: Volume 445NR
Electronic Packaging Materials Science IX: Volume 445
By: Steven K. Groothuis, Kenzo Ishida, Paul S. (University of Texas, Austin) Ho, Tien Wu, Paul S Ho
Publisher: Materials Research Society
No Review Yet
₹2,134
Binding:
Hardback
Release:
20 Oct 1997
Language:
English
Out of Stock
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5.
Electronic Packaging Materials Science VI: Volume 264NR
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
No Review Yet
₹2,172
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
Out of Stock
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