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Paul S. Ho

Paul S. Ho

15 results found
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1.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: Paul S. Ho, Wei William Lee, Jihperng Leu, Paul S Ho
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹14,070
₹8,864
Binding:
Paperback
Release:
04 Oct 2012
Language:
English
Available
Ships within 12-14 Days Explain..
2.
Stress-Induced Phenomena in Metallization
Stress-Induced Phenomena in Metallization
By: Eduard Arzt, Paul S Ho, Shefford P Baker, Matti A Korhonen
Publisher: American Institute of Physics
No Review Yet
₹1,327
Binding:
Hardback
Release:
09 Apr 2002
Language:
English
Available
Ships within 1-2 Days Explain..
3.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: W. W. Lee, P. S. Ho, Paul S. Ho, Wei William Lee, Jihperng Leu
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹14,070
₹8,864
Binding:
Hardback
Release:
14 Nov 2002
Language:
English
Available
Ships within 12-14 Days Explain..
4.
Materials Reliability in Microelectronics III: Volume 30937 %
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
No Review Yet
₹2,768
₹1,744
Binding:
Hardback
Release:
31 Aug 1993
Language:
English
Available
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5.
Advanced Interconnects for ULSI Technology43 %
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Mikhail R. Baklanov, Paul S. Ho, Paul S Ho
Publisher: Wiley
No Review Yet
₹21,275
₹12,127
Binding:
Hardback
Release:
02 Apr 2012
Language:
English
Available
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6.
Electromigration in Metals10 % NR
Electromigration in Metals
By: Valeriy Sukharev, Martin Gall, Paul S. (University of Texas, Austin) Ho, Paul S Ho, Chao-Kun Hu
Publisher: Cambridge University Press
No Review Yet
₹8,400
₹7,560
Binding:
Hardback
Release:
12 May 2022
Language:
English
International Edition
Ships within 18-20 Days Explain..
Free Shipping in India and low cost Worldwide.
7.
Materials Reliability in Microelectronics III: Volume 30915 % POD/NR
Materials Reliability in Microelectronics III: Volume 309
By: William F. Filter, Paul S. (University of Texas, Austin) Ho, Harold J. (Dartmouth College, New Hampshire) Frost, Harold J Frost, Kenneth P Rodbell
Publisher: Cambridge University Press
No Review Yet
₹2,940
₹2,499
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
8.
Electronic Packaging Materials Science V: Volume 20311 %
Electronic Packaging Materials Science V: Volume 203
By: Paul S. Ho, Edwin D. Lillie, Ralph Jaccodine, Kenneth Jackson, Ralph J. Jaccodine
Publisher: Cambridge University Press
No Review Yet
₹2,260
₹2,011
Binding:
Hardback
Release:
07 Jun 1991
Language:
English
Out of Stock
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9.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Paul Totta, Paul Tuha, Che-Yu Li, C y Li, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹10,585
Binding:
Hardback
Release:
14 Apr 2000
Language:
English
Out of Stock
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10.
Materials Reliability Issues in Microelectronics: Volume 225NR
Materials Reliability Issues in Microelectronics: Volume 225
By: James R. Lloyd, Paul S. (IBM T J Watson Research Center, New York) Ho, Frederick G. Yost, James R Lloyd, Paul S Ho
Publisher: Cambridge University Press
No Review Yet
₹2,664
Binding:
Hardback
Release:
22 Oct 1991
Language:
English
Out of Stock
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11.
Electronic Packaging Materials Science IX: Volume 445NR
Electronic Packaging Materials Science IX: Volume 445
By: Steven K. Groothuis, Kenzo Ishida, Paul S. (University of Texas, Austin) Ho, Tien Wu, Paul S Ho
Publisher: Materials Research Society
No Review Yet
₹2,134
Binding:
Hardback
Release:
20 Oct 1997
Language:
English
Out of Stock
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12.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: John Sanchez, Che-Yu Li, John Bravman, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹12,315
Binding:
Hardback
Release:
15 Apr 1998
Language:
English
Out of Stock
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13.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Tomoji Nakamura, Cynthia A Volkert, Paul S Ho, Shefford P Baker
Publisher: American Institute of Physics
No Review Yet
₹11,956
Binding:
Hardback
Release:
01 Dec 2004
Language:
English
Out of Stock
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14.
Stress-Induced Phenomena in MetallizationNR
Stress-Induced Phenomena in Metallization
By: Ehrenfried Zschech, Shinichi Ogawa, Paul S Ho
Publisher: American Institute of Physics
No Review Yet
₹10,655
Binding:
Hardback
Release:
01 Jun 2009
Language:
English
Out of Stock
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15.
Electronic Packaging Materials Science VI: Volume 264NR
Electronic Packaging Materials Science VI: Volume 264
By: Che-Yu Li, Che-Yu (Cornell University, New York) Li, Paul S. (University of Texas, Austin) Ho, Kenneth A. (University of Arizona) Jackson, G. Ferris Lipscomb
Publisher: Materials Research Society
No Review Yet
₹2,172
Binding:
Hardback
Release:
12 Nov 1992
Language:
English
Out of Stock
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