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Paul S. Ho

Paul S. HoPaul Ho is Professor Emeritus in the Department of Mechanical Engineering and the Texas Materials Institute at the University of Texas at Austin. He has received research awards from the Electrochemical Society, IEEE, IITC and Semiconductor Industry ssociation, among others. Read More Read Less

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1.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: Paul S. Ho, Wei William Lee, Jihperng Leu
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹16,424
₹10,347
Binding:
Paperback
Release:
04 Oct 2012
Language:
English
Available
Ships within 14-16 Days Explain..
2.
Low Dielectric Constant Materials for IC Applications37 %
Low Dielectric Constant Materials for IC Applications
By: Paul S. Ho, Wei William Lee, Jihperng Leu
Publisher: Springer-Verlag Berlin and Heidelberg GmbH & Co. KG
No Review Yet
₹16,424
₹10,347
Binding:
Hardback
Release:
14 Nov 2002
Language:
English
Available
Ships within 14-16 Days Explain..
3.
Stress-induced Phenomena in Metallization
Stress-induced Phenomena in Metallization
By: Ehrenfried Zschech, Paul S. Ho, Shinichi Ogawa
Publisher: American Institute of Physics
No Review Yet
₹1,882
Binding:
Hardback
Release:
13 Nov 2007
Language:
English
Available
Ships within 10-12 Days Explain..
4.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho
Publisher: John Wiley & Sons Inc
No Review Yet
₹11,582
Binding:
Hardback
Release:
02 Mar 2012
Language:
English
Available
Ships within 10-12 Days Explain..
5.
Electromigration in Metals5 % NR
Electromigration in Metals
By: Valeriy Sukharev, Paul S. Ho, Martin Gall, Chao-Kun Hu
Publisher: Cambridge University Press
No Review Yet
₹9,516
₹9,040
Binding:
Hardback
Release:
12 May 2022
Language:
English
International Edition
Ships within 8-10 Days Explain..
Free Shipping in India and low cost Worldwide.
6.
Tackling Trauma28 % POD/NR
Tackling Trauma
By: Shirley S. Ho, John Steward, Ida Glaser, Kethoser Aniu Kevichusa, Paul A. Barker
Publisher: Langham Publishing
No Review Yet
₹2,896
₹2,085
Binding:
Paperback
Release:
14 Mar 2019
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
7.
Materials Reliability in Microelectronics III: Volume 309POD/NR
Materials Reliability in Microelectronics III: Volume 309
By: Harold J. Frost, William F. Filter, Paul S. Ho, Kenneth P. Rodbell
Publisher: Cambridge University Press
No Review Yet
₹3,256
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
International Edition
Ships within 12-14 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
8.
Silicon Materials–Processing, Characterization and Reliability: Volume 716
Silicon Materials–Processing, Characterization and Reliability: Volume 716
By: Paul S. Ho, Janice L. Veteran, David L. O'Meara, Veena Misra
Publisher: Materials Research Society
No Review Yet
₹2,941
Binding:
Hardback
Release:
11 Oct 2002
Language:
English
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9.
The Backend at the Forefront
The Backend at the Forefront
By: Paul S. Ho, James D. Meindl, Betsy Weitzman, Evan Davidson, Fabio Pintchovski
Publisher: I.E.E.E.Press
No Review Yet
₹27,254
Binding:
Video
Release:
01 Jan 1996
Language:
English
Out of Stock
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10.
Electronic Packaging Materials Science V: Volume 20311 %
Electronic Packaging Materials Science V: Volume 203
By: Paul S. Ho, Edwin D. Lillie, Ralph Jaccodine, Kenneth Jackson
Publisher: Materials Research Society
No Review Yet
₹2,260
₹2,011
Binding:
Hardback
Release:
07 Jun 1991
Language:
English
Out of Stock
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11.
Stress-induced Phenomena in Metallization12 %
Stress-induced Phenomena in Metallization
By: C. Y. Li, P. S. Ho, Paul A. Totta
Publisher: American Institute of Physics
No Review Yet
₹7,682
₹6,760
Binding:
Hardback
Release:
27 Mar 1998
Language:
English
Out of Stock
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12.
Materials Reliability in Microelectronics III: Volume 30953 %
Materials Reliability in Microelectronics III: Volume 309
By: Harold J. Frost, William F. Filter, Paul S. Ho, Kenneth P. Rodbell
Publisher: Materials Research Society
No Review Yet
₹2,907
₹1,366
Binding:
Hardback
Release:
31 Aug 1993
Language:
English
Out of Stock
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13.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho
Publisher: John Wiley & Sons Inc
No Review Yet
₹20,108
Binding:
Digital (delivered electronically)
Release:
17 Feb 2012
Language:
English
Out of Stock
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14.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho
Publisher: John Wiley & Sons Inc
No Review Yet
₹20,108
Binding:
Digital (delivered electronically)
Release:
17 Feb 2012
Language:
English
Out of Stock
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15.
Advanced Interconnects for ULSI Technology
Advanced Interconnects for ULSI Technology
By: Mikhail Baklanov, Ehrenfried Zschech, Paul S. Ho
Publisher: John Wiley & Sons Inc
No Review Yet
₹20,108
Binding:
Digital (delivered electronically)
Release:
17 Feb 2012
Language:
English
Out of Stock
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16.
Silicon Materials–Processing, Characterization and Reliability: Volume 7162 % NR
Silicon Materials–Processing, Characterization and Reliability: Volume 716
By: Paul S. Ho, Janice L. Veteran, David L. O'Meara, Veena Misra
Publisher: Cambridge University Press
No Review Yet
₹2,732
₹2,684
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
Out of Stock
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17.
Electronic Packaging Materials Science IX: Volume 445NR
Electronic Packaging Materials Science IX: Volume 445
By: Paul S. Ho, Steven K. Groothuis, Kenzo Ishida, Tien Wu
Publisher: Materials Research Society
No Review Yet
₹2,134
Binding:
Hardback
Release:
20 Oct 1997
Language:
English
Out of Stock
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18.
Electronic Packaging Materials Science V: Volume 203NR
Electronic Packaging Materials Science V: Volume 203
By: Paul S. Ho, Edwin D. Lillie, Ralph Jaccodine, Kenneth Jackson
Publisher: Cambridge University Press
No Review Yet
₹3,177
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
Out of Stock
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19.
Materials Reliability Issues in Microelectronics: Volume 2252 % NR
Materials Reliability Issues in Microelectronics: Volume 225
By: James R. Lloyd, Paul S. Ho, Frederick G. Yost
Publisher: Cambridge University Press
No Review Yet
₹2,732
₹2,684
Binding:
Paperback
Release:
05 Jun 2014
Language:
English
Out of Stock
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