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Foundations of MEMS

Foundations of MEMS

          
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About the Book

For courses in Micro-Electro-Mechanical Systems (MEMS) taken by advanced undergraduate students, beginning graduate students, and professionals.     Foundations of MEMS is the first entry-level text of its kind for systematically teaching the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology – all in a time-efficient and methodical manner. A wealth of examples and problems solidify students’ understanding of abstract concepts and provide ample opportunities for practicing critical thinking. 

Table of Contents:
(NOTE: All chapters start with a Preview and conclude with Problems and References.)   Chapter 1: Introduction  1.0. Preview 1.1. The History of MEMS Development   1.2. The Intrinsic Characteristics of MEMS 1.3. Devices: Sensors and Actuators   Chapter 2: Introduction to Microfabrication 2.0. Preview 2.1. Overview of Microfabrication 2.2. The Microelectronics Fabrication Process 2.3. Silicon-based MEMS Process 2.4. New Materials and Fabrication Processes 2.5. Points of Consideration for Processing   Chapter 3: Review of Essential Electrical and Mechanical Concepts  3.0. Preview  3.1. Conductivity of Semiconductors 3.2. Crystal Planes and Orientations  3.3. Stress and Strain    3.4. Flexural Beam Bending Analysis Under Simple Loading Conditions    3.5. Torsional Deflections   3.6. Intrinsic Stress    3.7. Resonant Frequency and Quality Factor    3.8. Active Tuning of Spring Constant and Resonant Frequency 3.9. A List of Suggested Courses and Books   Chapter 4: Electrostatic Sensing and Actuation 4.0. Preview 4.1. Introduction to Electrostatic Sensors and Actuators 4.2. Parallel-Plate Capacitors 4.3. Applications of Parallel-Plate Capacitors    4.4. Interdigitated Finger Capacitors    4.5. Applications of Comb-Drive Devices     Chapter 5: Thermal Sensing and Actuation 5.0. Preview 5.1. Introduction  5.2. Sensors and Actuators Based on Thermal Expansion 5.3. Thermal Couples   5.4. Thermal Resistors 5.5. Applications    Chapter 6:  Piezoresistive Sensors   6.0. Preview 6.1. Origin and Expression of Piezoresistivity   6.2. Piezoresistive Sensor Materials 6.3. Stress Analysis of Mechanical Elements  6.4. Applications of Piezoresistive Sensors     Chapter 7: Piezoelectric Sensing and Actuation 7.0. Preview 7.1. Introduction  7.2. Properties of Piezoelectric Materials 7.3. Applications    Chapter 8: Magnetic Actuation 8.0. Preview 8.1. Essential Concepts and Principles    8.2 Fabrication of Micromagnetic Components    8.3. Case Studies of MEMS Magnetic Actuators   Chapter 9: Summary of Sensing and Actuation 9.0. Preview 9.1. Comparison of Major Sensing and Actuation Methods   9.2. Tunneling Sensing   9.3. Optical Sensing   9.4. Field Effect Transistors   9.5. Radio Frequency Resonance Sensing     Chapter 10: Bulk Micromachining and Silicon Anisotropic Etching   10.0. Preview 10.1. Introduction  10.2. Anisotropic Wet Etching   10.3. Dry Etching of Silicon - Plasma Etching   10.4. Deep Reactive Ion Etching (DRIE)    10.5. Isotropic Wet Etching   10.6. Gas-Phase Etchants  10.7. Native Oxide     10.8. Wafer bonding   10.9. Case Studies     Chapter 11: Surface Micromachining     11.0. Preview 11.1. Basic Surface Micromachining Processes 11.2. Structural and Sacrificial Materials 11.3. Acceleration of Sacrificial Etch   11.4. Stiction and AntiStiction Methods   11.5. Assembly of 3D MEMS 11.6. Foundry Process     Chapter 12: Polymer MEMS 12.0. Preview 12.1. Introduction  12.2. Polymers in MEMS   12.3. Representative Applications    Chapter 13: Microfluidics Applications  13.0. Preview 13.1. Motivation for Microfluidics 13.2. Essential Biology Concepts  13.3. Basic Fluid Mechanics Concepts  13.4. Design and Fabrication of Selective Components      Chapter 14: Instruments for Scanning Probe Microscopy    14.0. Preview 14.1. Introduction  14.2. General Fabrication Methods for Tips  14.3. Cantilevers with Integrated Tips    14.4. SPM probes with Sensors and Actuators   Chapter 15: Optical MEMS 15.0. Preview 15.1. Passive MEMS Optical Components    15.2. Actuators for Active Optical MEMS   Chapter 16.  MEMS Technology Management    16.0. Preview 16.1. R&D Strategies   


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Product Details
  • ISBN-13: 9780131472860
  • Publisher: Pearson Education (US)
  • Publisher Imprint: Pearson
  • Edition: 1
  • Language: English
  • Series Title: English
  • Weight: 1066 gr
  • ISBN-10: 0131472860
  • Publisher Date: 03 Oct 2005
  • Binding: Hardback
  • Height: 198 mm
  • No of Pages: 576
  • Spine Width: 30 mm
  • Width: 241 mm


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