This is the eBook of the printed book and may not include any media, website access codes, or print supplements that may come packaged with the bound book. For courses in Micro-Electro-Mechanical Systems (MEMS) taken by advanced undergraduate students, beginning graduate students, and professionals. Foundations of MEMS is an entry-level text designed to systematically teach the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology — all in a time-efficient and methodical manner. A wealth of examples and problems solidify students’ understanding of abstract concepts and provide ample opportunities for practicing critical thinking.

Table of Contents:
Preface to Second Edition Preface to First Edition Note to Instructors About the Author Notational Conventions Chapter 1: Introduction 1.0. Preview     1.1.  The History of MEMS Development     1.1.1. From the Beginning to 1990     1.1.2. From 1990 to 2001     1.1.3. 2002 to present     1.1.4. Future Trends     1.2. The Intrinsic Characteristics of MEMS     1.2.1. Miniaturization     1.2.2. Microelectronics Integration     1.2.3. Parallel Fabrication with Precision     1.3. Devices: Sensors and Actuators          1.3.1. Energy Domains and Transducers          1.3.2. Sensors Considerations          13.3.  Sensor Noise and Design Complexity          1.3.4. Actuators Considerations          Summary    Problems  References  Chapter 2: First-Pass Introduction to Microfabrication            2.0. Preview          2.1. Overview of Microfabrication          2.2. Essential Overview of Frequently Used Microfabrication Processes     2.2.1. Photolithography          2.2.2. Thin film deposition          2.2.3. Thermal oxidation of silicon          2.2.4. Wet Etching          2.2.5. Silicon anisotropic etching          2.2.6. Plasma etching and reactive ion etching          2.2.7. Doping          2.2.8. Wafer dicing          2.2.9. Wafer bonding          2.3. The Microelectronics Fabrication Process Flow          2.4. Silicon-based MEMS Processes          2.5. Packaging and Integration          2.5.1. Integration Options          2.5.2. Encapsulation          2.6. New Materials and Fabrication Processes          2.7. Process Selection and Design          2.7.1. Points of Consideration for Deposition Processes     2.7.2. Points of Consideration for Etching Processes          2.7.3. Ideal Rules for Building a Process Flow          2.7.4. Rules for Building a Robust Process          Summary          Problems          References          Chapter 3: Review of Essential Electrical and Mechanical Concepts          3.0 Preview          3.1. Conductivity of Semiconductors          3.1.1. Semiconductor Materials          3.1.2. Calculation of Charge Carrier Concentration          3.1.3. Conductivity and Resistivity          3.2. Crystal Planes and Orientations          3.3. Stress and Strain          3.3.1. Internal Force Analysis: Newton's Laws of Motion          3.3.2. Definitions of Stress and Strain          3.3.3. General Scalar Relation between Tensile Stress and Strain          3.3.4. Mechanical Properties of Silicon and Related Thin Films          3.3.5. General Stress — Strain Relations          3.4. Flexural Beam Bending Analysis under Simple Loading Conditions          3.4.1. Types of Beams          3.4.2. Longitudinal Strain under Pure Bending          3.4.3. Deflection of Beams          3.4.4. Finding the Spring Constants          3.5. Torsional Deflections          3.6. Intrinsic Stress          3.7. Dynamic System, Resonant Frequency, and Quality Factor          3.7.1. Dynamic System and Governing Equation          3.7.2. Response under Sinusoidal Resonant Input          3.7.3. Damping and Quality Factor          3.7.4. Resonant Frequency and Bandwidth          3.8. Active Tuning of Spring Constant and Resonant Frequency          3.9. A List of Suggested Courses and Books          Summary          Problems          References           Chapter 4: Electrostatic Sensing and Actuation Section 4.0. Preview          Section 4.1.  Introduction to Electrostatic Sensors and Actuators          Section 4.2. Parallel Plate Capacitor          4.2.1. Capacitance of Parallel Plates          4.2.2.  Equilibrium Position of Electrostatic Actuator under Bias          4.2.3. Pull-in Effect of Parallel-Plate Actuators          Section 4.3. Applications of Parallel-Plate Capacitors          4.3.1. Inertia Sensor          4.3.2. Pressure Sensor          4.3.3. Flow Sensor          4.3.4. Tactile sensor          4.3.5. Parallel-plate actuators          Section 4.4. Interdigitated Finger Capacitors          Section 4.5. Applications of Comb-Drive Devices          4.5.1. Inertia Sensors          4.5.2. Actuators          Summary          Problems          References          Chapter 5: Thermal Sensing and Actuation 5.0.     Preview          5.1. Introduction          5.1.1. Thermal Sensors          5.1.2. Thermal Actuators          5.1.3. Fundamentals of Thermal Transfer          5.2. Sensors and Actuators Based on Thermal Expansion 5.2.1. Thermal Bimorph Principle          5.2.2. Thermal Actuators with a Single Material          5.3. Thermal Couples          5.4. Thermal Resistors          5.5. Applications          5.5.1. Inertia Sensors          5.5.2. Flow Sensors          5.5.3. Infrared Sensors          5.5.4. Other Sensors          Summary          Problems          References          Chapter 6:  Piezoresistive Sensors          6.0.     Preview          6.1.     Origin and Expression of Piezoresistivity          6.2.     Piezoresistive Sensor Materials          6.2.1. Metal Strain Gauges          6.2.2.     Single Crystal Silicon          6.2.3. Polycrystalline Silicon          6.3. Stress Analysis of Mechanical Elements          6.3.1. Stress in Flexural Cantilevers          6.3.2. Stress and Deformation in Membrane          6.4. Applications of Piezoresistive Sensors          6.4.1. Inertial Sensors          6.4.2. Pressure Sensors          6.4.3. Tactile sensor          6.4.4. Flow sensor          Summary          Problems          References          Chapter 7: Piezoelectric Sensing and Actuation     7.0. Preview     7.1. Introduction     7.1.1. Background    7.1.2. Mathematical description of piezoelectric effects     7.1.3. Cantilever piezoelectric actuator model     7.2. Properties of Piezoelectric Materials     7.2.1. Quartz     7.2.2. PZT     7.2.3. PVDF     7.2.4. ZnO     7.2.5. Other Materials     7.3. Applications     7.3.1. Inertia Sensors     7.3.2. Acoustic Sensors     7.3.3. Tactile Sensors     7.3.4. Flow Sensors     7.3.5. Surface Elastic Waves     Summary     Problems     References     Chapter 8: Magnetic Actuation     8.0. Preview     8.1. Essential Concepts and Principles     8.1.1. Magnetization and Nomenclatures     8.1.3. Selected Principles of Micro Magnetic Actuators     8.2 Fabrication of Micro Magnetic Components     8.2.1. Deposition of Magnetic Materials     8.2.2. Design and Fabrication of Magnetic Coil     8.3. Case Studies of MEMS Magnetic Actuators    Summary     Problems     References     Chapter 9: Summary of Sensing and Actuation Methods 9.0. Preview     9.1. Comparison of Major Sensing and Actuation Methods    9.2. Other Sensing and Actuation Methods    9.2.1. Tunneling Sensing     9.2.3 Optical Sensing     9.2.4. Field Effect Transistors     9.2.5. Radio Frequency Resonance Sensing     Summary     Problems    References    Chapter 10: Bulk Micromachining and Silicon Anisotropic Etching     10.0.      Preview     10.1.     Introduction     10.2.     Anisotropic Wet Etching     10.2.1. Introduction     10.2.2. Rules of Anisotropic Etching–Simplest Case   10.2.3. Rules of Anisotropic Etching–Complex Structures     10.2.4. Forming Protrusions   10.2.5. Interaction of Etching Profiles from Isolated Patterns     10.2.6. Summary of design methodology    10.2.7. Chemicals for Wet Anisotropic Etching     10.3. Dry Etching and Deep Reactive Ion Etching     10.4. Isotropic Wet Etching   10.5. Gas Phase Etchants     10.6. Native Oxide     10.7. Special Wafers and Techniques     Summary     Problems     References     Chapter 11: Surface Micromachining     11.0. Preview     11.1. Basic Surface Micromachining Processes     11.1.1.     Sacrificial Etching Process     11.1.2. Micro Motor Fabrication Process–A First Pass     11.2.3. Micro Motor Fabrication Process–A Second Pass     11.1.4. Micro Motor Fabrication Process–Third Pass     11.2. Structural and Sacrificial Materials     11.2.1. Material Selection Criteria for a Two-layer Process    11.2.2. Thin Films by Low Pressure Chemical Vapor Deposition     11.2.3. Other Surface Micromachining Materials and Processes     11.3. Acceleration of Sacrificial Etch     11.4. Stiction and Anti-stiction Methods     Summary     Problems     References     Chapter 12: Process Synthesis: Putting It all Together     12.0.     Preview     12.1. Process for Suspension Beams     12.2. Process for Membranes     12.3. Process for Cantilevers     12.3.1. SPM Technologies Case Motivation     12.3.2. General Fabrication Methods for Tips    12.3.3. Cantilevers with Integrated Tips     12.3.4. Cantilevers with Integrated Sensors     12.3.5. SPM Probes with Actuators     12.4. Practical Factors Affecting Yield of MEMS     Summary     Problems     References     Chapter 13: Polymer MEMS     13.0. Preview     13.1. Introduction     13.2. Polymers in MEMS     13.2.1. Polyimide     13.2.2. SU-8     13.2.3. Liquid Crystal Polymer (LCP)     13.2.4. PDMS     13.2.5. PMMA    13.2.6. Parylene   13.2.7. Fluorocarbon    13.2.8. Other Polymers     13.3. Representative Applications     13.3.1. Acceleration Sensors     13.3.2. Pressure Sensors     13.3.3. Flow sensors     13.3.4. Tactile Sensors     Summary     Problems     Reference     Chapter 14: Micro Fluidics Applications    14.0. Preview     14.1. Motivation for Microfluidics     14.2. Essential Biology Concepts     14.3. Basic Fluid Mechanics Concepts    14.3.1. The Reynolds Number and Viscosity     14.3.2. Methods for Fluid Movement in Channels     14.3.3. Pressure Driven Flow     14.3.4. Electrokinetic Flow     14.3.5. Electrophoresis and Dielectrophoresis     14.4. Design and Fabrication of Selective Components     14.4.1. Channels     14.4.2. Valves     Summary     Problems     References     Chapter 15: Case Studies of Selected MEMS Products     15.0. Preview     15.1. Case Studies: Blood Pressure (BP) Sensor    15.1.1. Background and History    15.1.2. Device Design Considerations     15.1.3. Commercial Case: NovaSensor BP Sensor     15.2. Case Studies: Microphone     15.2.1. Background and History     15.2.2. Design Considerations     15.2.3. Commercial Case: Knowles Microphone     15.3. Case Studies: Acceleration Sensors     15.3.1. Background and History     15.4.2. Design Considerations     15.4.1. Commercial Case: Analog Devices and MEMSIC    15.4. Case Studies: Gyros     15.4.1. Background and History     15.4.2. The Coriolis Force   15.4.3. MEMS Gyro Design     15.4.4. Single Axis Gyro Dynamics    15.4.4. Commercial Case: InvenSense Gyro     15.5 Summary of Top Concerns for MEMS Product Development     15.5.1. Performance and Accuracy     15.5.2. Repeatability and Reliability     15.5.3. Managing the Cost of MEMS Products     15.5.4. Market Uncertainties, Investment, and Competition     Summary     Problems     References     Appendix 1: Characteristics of selected MEMS material Appendix 2: Frequently Used Formula for Beams, Cantilevers, and Plates Appendix 3: Basic Tools for Dealing with a Mechanical Second-order Dynamic System Appendix 4: Most Commonly Encountered Materials Appendix 5: Most Commonly Encountered Material Removal Process Steps Appendix 6: A List of General Compatibility between General Materials and Processes Appendix 7: Comparison of Commercial Inertial Sensors Answers to selected problems Index