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Beth Keser

Beth Keser

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1.
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies5 % POD/NR
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
By: Beth Keser, Steffen Kr¿hnert
Publisher: John Wiley & Sons Inc
No Review Yet
₹13,661
₹12,978
Binding:
Hardback
Release:
29 Mar 2019
Language:
English
International Edition
Ships within 16-18 Days Explain..
Free Shipping in India and low cost Worldwide.
Print On Demand
Print On Demand (POD) titles : are those which have been especially printed by the Publisher / Vendor partner only after an order for them has been received. They are also classified as Non-Returnable.
Non-Returnable titles : are those which have been classified as Non-Returnable under any circumstance by International Publishers / Vendor partners.
2.
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces49 % NR
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
By: Beth Keser, Steffen Kr¿hnert
Publisher: John Wiley & Sons Inc
No Review Yet
₹14,508
₹7,399
Binding:
Hardback
Release:
04 Jan 2022
Language:
English
International Edition
Ships within 14-16 Days Explain..
Free Shipping in India and low cost Worldwide.
3.
Advances in Embedded and Fan–Out Wafer Level Packaging Technologies
Advances in Embedded and Fan–Out Wafer Level Packaging Technologies
By: Beth Keser, Steffen Kr¿hnert
Publisher: John Wiley and Sons Ltd
No Review Yet
₹12,512
Binding:
Other digital
Release:
19 Apr 2019
Language:
English
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